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Vacuum device for reflow soldering furnace

A vacuum device and reflow soldering furnace technology, applied in auxiliary devices, assembling printed circuits with electrical components, welding equipment, etc., can solve problems such as damage, solder joint voids, and inability to discharge gas, reducing size and quantity, and improving reliability. The effect of degree and applicability

Pending Publication Date: 2021-07-23
上海朗仕电子设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The requirements for product quality are also getting higher and higher. In order to meet the new needs of the market, reduce product defects caused by welding, and improve product productivity and pass rate, the design of the reflow oven should ensure that the welding process is reliable and stable. However, the existing During the soldering process of most SMT reflow ovens, there may be gas that cannot be discharged, resulting in voids inside the solder joints, which in turn affects the reliability of product soldering.
In addition, in the molten state of solder paste, the flux may cause damage to the heating module equipment of the reflow oven, thereby affecting the processing effect of the reflow oven

Method used

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  • Vacuum device for reflow soldering furnace
  • Vacuum device for reflow soldering furnace
  • Vacuum device for reflow soldering furnace

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Such as figure 1 , 2 As shown, the present invention relates to a vacuum device for a reflow oven, which includes a vacuum chamber 1 , a vacuum pump system 2 and a cooling collection auxiliary device 3 . The vacuum cavity 1 is connected to the auxiliary cooling and collection device 3 through a first connecting pipeline 12 , and the auxiliary cooling and collecting device 3 is connected to the vacuum pump system 2 through a second connecting pipeline 13 . The vacuum system 2 is opened and closed through the isolation valve. The vacuum device of the present invention replaces the heating module in the reflow zone in the reflow furnace, that is, the vacuum cavity 1, the vacuum pump system 2 and the cooling collection auxiliary device 3 are installed in the reflow zone of the reflow furnace 16, such as image 3 shown.

[0031] Such as Figure 4 As shown, the vacuum chamber 1 includes a chamber body 4 , a top cover 5 and a side door mechanism 6 . The cavity body 4 is f...

Embodiment 2

[0039] As a more preferred solution, this embodiment is based on the structure of Embodiment 1. The vacuum degree measuring instrument of the cavity body 4 is connected to the PC end, and the controllers of each telescopic cylinder are connected to the PC end, and the vacuum can be completed through the visual operation interface. Operational control and monitoring.

Embodiment 3

[0041] As a more preferred solution, on the basis of the structure of Example 1, an additional heating assembly is provided in the cavity body 4 in this embodiment. Heating module or infrared heating module including filter and other components. Arranging the heating assembly in the cavity body 4 can prolong the process of the melting state of the solder paste, and can increase the effect of vacuuming the vacuum cavity. It should be noted that the infrared heating module of this embodiment can use components that use infrared heating to achieve heating in the prior art, and the specific structure will not be repeated here.

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Abstract

The invention relates to a vacuum device for a reflow soldering furnace. The vacuum device is arranged at the position of an original heating module in a reflow area of the reflow soldering furnace and comprises a vacuum cavity, a cooling and collecting auxiliary device and a vacuum pump system which are sequentially connected, the vacuum cavity comprises a cavity body, a top cover and side door mechanisms, the cavity body is fixed in the reflow furnace, the top cover covers the top of the cavity body, the front end and the rear end of the cavity body are respectively provided with two through holes, the two side door mechanisms are movably arranged at the front end and the rear end of the cavity body and respectively cover the two through holes in a closed state, and the top cover, the cavity body and the side door mechanisms form a totally closed space. The cavity body is provided with a transmission assembly matched with a product transmission system of the reflow soldering furnace, and the two side door mechanisms correspond to the product input front end and the product output rear end of the reflow soldering furnace. Compared with the prior art, the device has the advantages of reducing the size and number of welding point cavities, reducing the damage rate, being high in applicability and the like.

Description

technical field [0001] The invention relates to the technical field of reflow soldering furnaces, in particular to a vacuum device for reflow soldering furnaces. Background technique [0002] Reflow Oven (Reflow Oven) is a device used to solder circuit boards carrying electronic components. It provides a heating environment to heat and melt the solder paste so that surface mount components and circuit boards are reliably bonded together through the solder paste alloy. The solder paste used for brazing is made of fat-like flux and powder solder into a paste, which is applied to the soldering parts of the components of the circuit board by printing, and the electronic components are precisely mounted on it, and the reflow oven is used to The heating module is used for heating and melting to achieve reliable brazing of components. [0003] With the development of the electronics industry in the direction of miniaturization and multiple specifications. The requirements for pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34B23K3/08
CPCH05K3/341B23K3/08
Inventor 詹姆斯·内维尔大卫·海乐卢明严超李占斌
Owner 上海朗仕电子设备有限公司
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