Laser processing device assisted by rotating magnetic field and ultrasonic vibration

Abstract

The invention discloses a laser processing device assisted by a rotating magnetic field and ultrasonic vibration. The laser processing device is composed of a rack, a laser processing device body, an ultrasonic vibration device, a workpiece clamping device, a rotating magnetic field device and a controller. The ultrasonic vibration device can realize multi-degree-of-freedom vibration through a medium, and can greatly reduce defects such as recast layers, oxides and microcracks in the laser processing process; the workpiece clamping device can achieve reverse rotation of the workpiece, laser processing of the workpiece with the large size can be achieved, and the taper generated in the laser processing process is reduced; the rotating magnetic field device adopts a rotating magnetic pole, discharging of plasmas in the laser machining process can be accelerated, and the processing quality of workpieces is improved. The device has the advantages of being reliable in work, high in processing quality, high in applicability, capable of achieving corner hole processing and the like.

Description

technical field [0001] The invention belongs to the field of laser processing, in particular to a laser processing device assisted by rotating magnetic field and ultrasonic vibration. Background technique [0002] With the development of science and technology, the demand for high-performance composite materials in the fields of aerospace, national defense and military industry continues to increase. However, due to its high hardness and high brittleness, there are problems such as tool wear and poor processing accuracy in traditional processing. Laser processing is used in the processing of high-performance composite materials with non-contact and no tool wear. However, for thick-sized materials, defects such as recasting layers, tapers, molten splashes, and oxides will appear when laser processing is used. Therefore, a laser is urgently needed. Processing devices to solve various problems in the processing of high-performance composite materials. [0003] In recent years,...

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Problems solved by technology

[0002] With the development of science and technology, the demand for high-performance composite materials in the fields of aerospace, national defense and military industry continues to increase. However, due to its high hardness and high brittleness, there are problems such as tool wear and poor processing accuracy in traditional processing. Laser processing is used in the processing of high-performance composite materials with non-contact and no tool wear. However, for thick-sized materials, defects such as recasting layers, tapers, molten splashes, and oxides will appear when laser processing is used. Therefore, a laser is urgently needed. Processing devices to solve various problems in the processing of high-performance composite materials

[0003] In recent years, some researchers have conducted research on double-sided laser processing. For example, the patent (201910376596.8) proposes a method for double-sided laser processing. Processing on both sides, or rotating the workpiece by 180°, although the taper of the hole is reduced to a certain extent, the coaxiality of the processed hole is difficult to ensure, and the plasma, melt and steam generated in the hole weaken the laser processing efficiency. Objects are difficult to discharge, making it difficult to ensure the stability of processing quality

[0004] In order to achieve double-sided processing of materials and solve the problems of taper, recasting layer, oxide, plasma, low processing quality, and low processing efficiency, it is necessary to design a laser processing device assisted by rotating magnetic field and ultrasonic vibration. Workpiece reversal and three-degree-of-freedom ultrasonic vibration to solve defects such as taper, recasting layer, heat-affected zone, plasma, micro-cracks, and low processing efficiency. A rotating magnetic field is used to reduce the impact of plasma on the laser during processing. to improve processing quality

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