Central liquid supplying machining method for chemically and mechanically polished semiconductor material and device thereof

Abstract

The invention discloses a central liquid supplying machining method for a chemically and mechanically polished semiconductor material. A polishing tool rotates, the polishing tool and a semiconductor workpiece move to each other according to a certain track, and a liquid membrane between the polishing tool and the semiconductor workpiece is controlled well by controlling a pressure of a polishing liquid and a load of the polishing tool. When a specific polishing process is adopted, a proper polishing pad provided by the invention is mounted on the polishing tool. After adopting a solidified abrasive center liquid supply polishing, the flatness of a wafer can reach micron dimension, the surface roughness can reach dozens of nanometers and sub-surface damage can reach micron level. By adopting small grinding head center liquid supply polishing, the flatness of the wafer is further improved, the surface roughness can reach nanoscale and the sub-surface damage is further reduced. By adopting disc type fluid dynamic polishing, the surface roughness of the wafer can reach submicron level, the sub-surface damage can reach submicron level, and sub-nano super-smooth surface machining is achieved, such that an ideal wafer is prepared.

Description

technical field [0001] The invention belongs to the field of semiconductor manufacturing, and relates to a chemical mechanical grinding and polishing method based on a central liquid supply type, in particular to a serialized processing method for thinning and polishing semiconductor materials to obtain nano-scale ultra-smooth surfaces. Background technique [0002] Semiconductor materials have become an indispensable part of high-end chips by virtue of their excellent material properties. Aspects such as flatness, roughness, metal, and grain have a significant impact on semiconductor devices. With the rapid development of chip technology in the fields of life, industry, medical treatment, and national defense technology, the efficient and high-precision manufacturing process of semiconductor materials has become a core technical problem that needs to be broken through. [0003] At present, the mainstream manufacturing process of semiconductor wafers is still dominated by c...

AI Technical Summary

Problems solved by technology

However, the traditional mechanical force controlled polishing method is still difficult to cope with the precision and subsurface damage requirements of semiconductor material preparation

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