Integrated packaging circuit
A technology of integrated circuits and circuits, applied in control/regulation systems, logic circuit connection/interface arrangement, and bidirectional operation of logic circuit coupling/interface, etc., can solve problems such as failure of electronic components and high cost
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[0039] figure 1 A system SYS according to an embodiment is shown. The system SYS comprises an inductance-capacitance sensor LC and an integrated circuit CI comprising an input / output unit IO, a main control circuit UPC and a processing unit UT.
[0040] The processing unit UT is configured to withstand a maximum voltage threshold. For example, the processing unit UT is configured to process signals with a maximum voltage amplitude of 5V.
[0041] The sensor LC includes an inductor Ls and a capacitor Cs installed in parallel.
[0042] The input / output unit IO includes a first port PAD to which the sensor LC is connected.
[0043] The input / output unit IO includes a first protection diode DD1 having an input (anode) connected to the first port PAD and an output (cathode) connected to a power supply terminal intended to receive the power supply voltage VDD. The input / output unit IO also includes a second protection diode DD2 having an input (anode) connected to the ground GN...
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