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Hard mica plate adhesive and preparation method thereof

A technology for adhesives and mica boards, applied in the direction of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of mica paper waste, reduce the performance of hard mica boards, anti-sticking, etc., and achieve the effect of improving hydrophobic performance

Pending Publication Date: 2021-07-30
PAMICA TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the process of use, it is sensitive to the ambient temperature. When the temperature is high in summer, the glued mica paper is too soft to cause paper breakage and anti-sticking. When the temperature is low in winter, the glued mica paper becomes hard and brittle, which will cause mica paper A lot of waste and reduce the performance of hard mica board

Method used

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  • Hard mica plate adhesive and preparation method thereof
  • Hard mica plate adhesive and preparation method thereof
  • Hard mica plate adhesive and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0023] This embodiment provides a hard mica board adhesive, comprising the following raw material components: 70 g of n-butanol, 400 g of toluene, 150 g of monomethyltrichlorosilane, 5 g of dimethyldichlorosilane, and 5 g of trimethylmonochlorosilane 3g, Propyltrichlorosilane 2g.

[0024] The preparation method of above-mentioned hard mica board adhesive is:

[0025] Add 480g of deionized water, 70g of n-butanol, and 280g of toluene into a three-necked flask equipped with a stirrer, a thermometer, and a dropping tube, and turn on the stirrer to stir thoroughly; 150g of silane, 5g of dimethyldichlorosilane, 3g of trimethylchlorosilane, 2g of propyltrichlorosilane, and 60g of toluene were added dropwise at a constant speed at 30°C, and stirred for half an hour after the addition; Move the material to the separatory funnel, let go the lower end of the aqueous solution, add 80°C hot water to wash until neutral, put the material into a three-necked flask equipped with a stirrer, t...

Embodiment 2

[0032] This embodiment provides a hard mica board adhesive, comprising the following raw material components: 60 g of n-butanol, 377 g of toluene, 140 g of monomethyltrichlorosilane, 6 g of dimethyldichlorosilane, and 6 g of trimethylmonochlorosilane 2g, 3g of propyltrichlorosilane.

[0033] The preparation method of above-mentioned hard mica board adhesive is:

[0034] Add 500g of deionized water, 60g of n-butanol, and 250g of toluene into a three-necked flask equipped with a stirrer, a thermometer, and a dropping tube, and turn on the stirrer to stir thoroughly, and add the mixed monomethyl trichloro Silane 140g, dimethyldichlorosilane 6g, trimethylmonochlorosilane 2g, propyltrichlorosilane 3g, toluene 70g. Perform uniform dropwise addition at 30°C, stir for half an hour after the dropwise addition, transfer the material in the three-neck flask to the separatory funnel, let go the lower end of the aqueous solution, add 80°C hot water to wash until neutral, and put the mater...

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Abstract

The invention discloses a hard mica plate adhesive and a preparation method thereof, and belongs to the field of mica plate adhesives. The hard mica plate adhesive comprises the following raw material components by mass: 6-8 parts of n-butanol, 31-42 parts of toluene, 13-17 parts of methyl trichlorosilane, and 0.3-1.7 parts of a hardness regulator; and the hardness regulator is prepared from the following components in parts by mass: 0.3 to 0.7 part of dimethyl dichlorosilane, 0.2 to 0.5 part of trimethyl chlorosilane and 0.2 to 0.5 part of propyl trichlorosilane. The preparation method comprises the following steps of: 1) mixing and fully stirring deionized water, n-butyl alcohol and toluene to obtain a mixed solution; 2) mixing methyl trichlorosilane, a hardness regulator and toluene, and dropwise adding the mixture into the mixed solution at a constant speed; and (3) separating the solution obtained in the step (2), and performing heating, stirring, concentrating and polymerizing; The adhesive is used at the room temperature of 10 DEG C or below, so the increasing trend of the molecular weight of the organic silicon adhesive in the curing process is slowed down, so that the hardness weakening trend occurs, and the hydrophobic performance of the adhesive is improved.

Description

technical field [0001] The invention belongs to the technical field of mica board adhesives, and in particular relates to a hard mica board adhesive and a preparation method thereof. Background technique [0002] The hard mica board is made of mica paper as the base material, supplemented by adhesives through sizing, pressing and other processes. The commonly used adhesives mainly include epoxy resin, silicone resin, polyurethane and other adhesives, especially silicone resin. The produced mica board has good electrical insulation performance, high and low temperature resistance, and fire resistance. It is widely used in batteries, motors and various electrical appliances as insulating diaphragm baffles, various heating plate substrates and insulating plates. [0003] However, the currently used silicone resin adhesive is synthesized by monomethyltrichlorosilane through hydrolysis, water washing, polycondensation and other processes, and belongs to the category of pressure-s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/04C09J11/04C08G77/04
CPCC09J183/04C09J11/04C08G77/04C08K3/34
Inventor 杨磊李新辉吴学领方爱国
Owner PAMICA TECH CORP
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