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Laser, laser transmitting plate assembly, laser radar and laser packaging method

一种激光器、发射板的技术，应用在激光领域，能够解决过程繁琐复杂等问题，达到提升测距性能的效果

Active Publication Date: 2021-07-30
HESAI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, within a certain size, the vertical angular resolution limit of lidar will be greatly restricted by the thickness of the circuit board and the height of components on the circuit board, etc.
[0008] Secondly, in order to ensure the consistency of the vertical angle of the laser radar, it is necessary to precisely fix the position of the circuit board carrying each laser, and the process is cumbersome and complicated

Method used

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  • Laser, laser transmitting plate assembly, laser radar and laser packaging method
  • Laser, laser transmitting plate assembly, laser radar and laser packaging method
  • Laser, laser transmitting plate assembly, laser radar and laser packaging method

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Embodiment Construction

[0046] In the following, only some exemplary embodiments are briefly described. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the drawings and descriptions are to be regarded as illustrative in nature and not restrictive.

[0047] In describing the present invention, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Straight", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", etc. or The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orie...

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Abstract

The invention relates to a laser, and the laser comprises a substrate provided with a positioning part; a laser chip which is arranged on the substrate, wherein the laser chip is provided with a light emitting surface; and a laser beam shaping element which is positioned through the positioning part and is opposite to the light emitting surface of the laser chip. The invention also relates to a laser packaging method and a laser radar comprising the laser. According to the technical scheme of the invention, the limit (only limited by the size of a fast axis) of the angular resolution of the laser emitting plate assembly in the vertical direction can be greatly improved, and an accurate positioning structure is processed on the silicon base, so the divergence angle of the compressed fast axis and the directivity of a light beam are effectively controlled, and the ranging performance is improved.

Description

[0001] This application is based on the divisional application No. 201910702011.7 filed on July 31, 2019, with the title of invention "Laser, laser emitting board assembly, laser radar and laser packaging method". technical field [0002] The invention relates to the technical field of lasers, in particular to a laser, a laser emitting board assembly including the laser, a laser radar and a packaging method of the laser. Background technique [0003] LiDAR is a general term for laser active detection sensor equipment. Its working principle is roughly as follows: the transmitter of the laser radar emits a beam of laser light. After the laser beam encounters an object, it returns to the laser receiver after diffuse reflection. The distance between the transmitter and the object can be calculated by multiplying the time interval between sending and receiving signals by the speed of light and dividing by 2. According to the number of laser beams, there are usually single-line li...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/00H01S5/40H01S5/02315G01S17/88G01S7/4911G01S7/484G01S7/481
CPCH01S5/005H01S5/4031G01S7/484G01S7/4911G01S7/4814G01S17/88
Inventor 李娜向少卿
Owner HESAI TECH CO LTD
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