Uniform-temperature plate, preparation method of the uniform-temperature plate and server
A technology of vapor chamber and substrate, which is applied in the construction of electrical equipment components, modification through conduction and heat transfer, cooling/ventilation/heating transformation, etc., which can solve the problems of difficult increase in processing capacity and high cost
Pending Publication Date: 2021-07-30
BEIJING BITMAIN TECH LTD
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Problems solved by technology
This existing vapor chamber has the following disadvantages in practical application: copper is used as the base material, coupled with complicated processes, resulting in very high cost, and it is difficult to increase the processing capacity.
Method used
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Embodiment approach
[0055] As an embodiment, the server includes an aluminum substrate or a PCB, on which heating components are arranged, and an end surface of the substrate 101 away from the heat sink 103 abuts against the aluminum substrate or the PCB.
[0056] The processing method of the vapor chamber 1 provided in this embodiment includes the following steps:
[0057] S1, preparing the vapor chamber body 10: the vapor chamber body 10 is integrally formed by aluminum extrusion, that is, the vapor chamber body 10 is formed by extruding aluminum;
[0058] S2, install the deflector 20 in the through groove 102 of the chamber body 10. In this embodiment, the installation method of the deflector 20 is to insert the deflector 20 into the positioning groove of the chamber body 10 Inside, the specific implementation method is to heat the chamber body 10 to a certain temperature, make the size of the first positioning groove 104 and the second positioning groove 105 larger, and put the deflector 20 i...
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The invention is suitable for the technical field of heat dissipation elements, and discloses a uniform-temperature plate, a preparation method of the uniform-temperature plate and a server, and the uniform-temperature plate comprises a uniform-temperature plate body, a cooling medium, at least one guide plate and two end covers; the uniform-temperature plate body comprises a substrate and at least two cooling fins, a through groove is formed in the substrate in a penetrating manner, the cooling fins are arranged on one side of the substrate in a protruding manner, and the substrate and the cooling fins are of an integrated structure formed by aluminum extrusion; the flow guide plate is arranged in the through groove and divides the through groove into at least two sub through grooves penetrating through the base plate, a plurality of through holes communicated with the two adjacent sub through grooves are formed in the flow guide plate in a penetrating mode, and a first capillary structure is formed on the surface of the flow guide plate; and the two cover plates cover and seal the two ends of the through groove respectively and define a closed inner cavity with the through groove, and the closed inner cavity is filled with the cooling medium. The uniform-temperature plate body is manufactured through aluminum extrusion forming, the machining process is simple, meanwhile, the multiple through holes communicating with the two adjacent sub through grooves are formed in the flow guide plate in a penetrating mode, and the heat dissipation effect is good.
Description
technical field [0001] The invention relates to the technical field of heat dissipation elements, in particular to a vapor chamber, a method for preparing a vapor chamber, and a server. Background technique [0002] A vapor chamber provided in the prior art includes a vapor chamber and a cooling fin, and the vapor chamber includes an upper cover, a bottom case and a copper column with a capillary structure. In the prior art vapor chamber, the copper column with capillary structure is placed on the bottom shell, and then the upper cover is closed, and the upper cover, the bottom shell and the copper column are connected into one body by welding. Then heat dissipation fins are welded to the outer surface of the upper cover. In actual application, this existing vapor chamber has the following disadvantages: the use of copper as the base material and the complicated process lead to very high cost, and it is difficult to increase the processing capacity. Contents of the invent...
Claims
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IPC IPC(8): H05K7/20
CPCH05K7/20509H05K7/2039H05K7/20709
Inventor 詹克团舒建军
Owner BEIJING BITMAIN TECH LTD