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Device, system and method for carrying pipe core carrier

A die and carrier technology, which is applied in transportation and packaging, photoengraving process of patterned surface, originals for opto-mechanical processing, etc. Complete satisfaction, human operator injuries, etc.

Pending Publication Date: 2021-08-03
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As such, huge human resources are required to transfer frame magazines in production equipment, which often results in human operator injuries
Additionally, production throughput is limited when manual operations during frame cassette transport cause process interruptions
[0004] As such, existing devices and methods for handling die carriers are not entirely satisfactory

Method used

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  • Device, system and method for carrying pipe core carrier
  • Device, system and method for carrying pipe core carrier
  • Device, system and method for carrying pipe core carrier

Examples

Experimental program
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Embodiment Construction

[0054] The following disclosure sets forth various exemplary embodiments for implementing different features of the subject matter. Specific examples of components and arrangements are set forth below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, in the following description, a first feature formed on or on a second feature may include embodiments in which the first feature is formed in direct contact with the second feature, and may also include embodiments in which the first feature is formed in direct contact with the second feature. Embodiments in which an additional feature may be formed between a first feature and a second feature such that the first feature and the second feature may not be in direct contact. Additionally, this disclosure may repeat reference numbers and / or letters in various instances. Such repetition is for simplicity and clarity and does not itself indicate a relationship be...

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PUM

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Abstract

The invention discloses a device and a method for automatically carrying a pipe core carrier. In one example, a disclosed device includes: at least one loading port, each configured to load a die carrier, the die carrier operable to receive a plurality of dies; and an interface tool coupled to the at least one loading port and the semiconductor processing unit. The interface tool includes: a first robot arm configured to transport the die carrier from the at least one loading port to the interface tool; and a second robot arm configured to transport the die carrier from the interface tool to the semiconductor processing unit to process at least one die in the die carrier.

Description

technical field [0001] Embodiments of the present invention relate to a device, system and method for transporting a die carrier. Background technique [0002] During the manufacture of semiconductor devices, the devices are typically processed at a number of workstations or processing machines. For example, integrated circuits are mass-produced on a single wafer, which may be diced into many pieces, each of which contains one copy of the circuitry and is called a die. Multiple dies can be accommodated on a frame, known as a frame cassette. [0003] Shipping or delivery of die carriers (eg, frame cassettes) is an important aspect of the overall manufacturing process. While an automated materials handling system (AMHS) can be used to automatically transport frame cassettes between various processing machines ("tools"), human operations are often required to load frame cassettes into and out of processing tools. Tool to remove the frame cassette. As such, enormous human re...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67201H01L21/67775H01L21/67733H01L21/67736H01L21/67766H01L21/67742H01L21/67745H01L21/67754H01L21/67757H01L21/67772G03F1/66
Inventor 郭宗圣李瑄白峻荣黄志宏朱延安吴政隆
Owner TAIWAN SEMICON MFG CO LTD