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Semiconductor package and method for fabricating same

A packaging and semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as increasing the density of delayed products

Pending Publication Date: 2021-08-03
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when many nonvolatile memory chips are connected to the same channel, some of these nonvolatile memory chips may be connected to the memory controller at distances that increase latency and reduce product density

Method used

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  • Semiconductor package and method for fabricating same
  • Semiconductor package and method for fabricating same
  • Semiconductor package and method for fabricating same

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0021] figure 1 is an exemplary block diagram illustrating a memory system including a semiconductor package according to an exemplary embodiment of the inventive concept.

[0022] refer to figure 1 , the storage system 1000a includes a host 1100 (for example, a host device) and a storage device 1200 .

[0023] According to some embodiments, the memory device 1200 includes a plurality of non-volatile memory packages (NVM PKG) 100-1, 100-2 to 100-n and a controller 200 (eg, a control circuit). A plurality of nonvolatile memory packages 100 - 1 , 100 - 2 to 100 - n may be used as storage media of the storage device 1200 . Each of the plurality of nonvolatile memory packages 100-1, 100-2 to 100-n may include a plurality of nonvolatile memory chips. In an exemplary embodiment, each of the plurality of nonvolatile memory chips includes a flash memory device.

[0024] The controller 200 may be connected to each of the plurality of nonvolatile memory packages 100-1, 100-2 to 100-...

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Abstract

A semiconductor package and a method for fabricating the same is provided. The semiconductor package includes: a substrate; a first buffer chip and a second buffer chip located on an upper part of the substrate; a plurality of nonvolatile memory chips located on the upper part of the substrate and including a first nonvolatile memory chip and a second nonvolatile memory chip, the first nonvolatile memory chip being electrically connected to the first buffer chip, and the second nonvolatile memory chip being electrically connected to the second buffer chip; a plurality of external connection terminals connected to a lower part of the substrate; and a rewiring pattern located inside the substrate. The rewiring pattern is configured to diverge an external electric signal received through one of the plurality of external connection terminals into first and second signals, transmit the first signal to the first buffer chip, and transmit the second signal to the second buffer chip.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 10-2020-0011060 filed on January 30, 2020, the disclosure of which is incorporated herein by reference in its entirety. technical field [0003] The present invention relates to a semiconductor device and its manufacturing method. Background technique [0004] A hard disk drive (HDD) including a magnetic disk has conventionally been used as a data storage device of an electronic system such as a computer system. With the development of semiconductor technology and portable devices, hard disk drives are gradually replaced by solid state drive (SSD) devices including nonvolatile memories such as flash memory (eg, NAND type flash memory). [0005] Solid state drive units generate less heat and noise than hard drives. In addition, solid state drive devices may have faster access rates, higher integration, and higher stability against external shocks than...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/18H01L21/50H01L23/498
CPCH01L25/18H01L25/50H01L23/49816H01L23/49838H01L23/5383H01L2225/06506H01L2225/06527H01L2225/06562H01L2225/0651H01L2225/06586G11C5/063G11C5/04G11C2207/105H01L25/0652H01L23/528H01L23/525H01L24/06
Inventor 李晟观
Owner SAMSUNG ELECTRONICS CO LTD
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