Wafer grinding equipment for research and development of high-side NMOSFET driver chip

Abstract

The invention discloses wafer grinding equipment for research and development of a high-side NMOSFET driver chip. The wafer grinding equipment comprises a workbench, a rectangular groove is formed in the center of the end part of the workbench, a connecting rod is fixedly mounted on the side wall of the workbench, a first motor is fixedly mounted at the end part of the connecting rod, and a column sleeve is fixedly mounted at the end part of the first motor; a hydraulic rod is fixedly mounted on the side, away from the first motor, of the column sleeve, an adjusting column penetrates through the interior of the hydraulic rod, a first strip-shaped groove and a second strip-shaped groove are formed in the side wall of the workbench, an adjusting mechanism sleeves the surface of the adjusting column and comprises threaded sleeves, and the two threaded sleeves are symmetrically arranged with the midpoint of the adjusting column as the center point; and the surfaces of the two threaded sleeves are opposite in thread direction, the threaded sleeves are arranged on the surface of the adjusting column in a sleeving mode, a rotating cap is fixedly installed at the end of the adjusting column, and a rotating disc is fixedly installed on the side, away from the column sleeves, of the hydraulic rod, so that when the equipment is used, the distance of grinding sleeves can be adjusted at will, the equipment is suitable for wafers of any size, and the application range is wider.

Description

technical field [0001] The present application relates to the technical field of wafer processing, and in particular to a wafer polishing equipment for research and development of high-side NMOSFET driver chips. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical monocrystalline silicon. After grinding, polishing and slicing, silicon wafers are formed, that is, wafers. At present, domestic wafer production lines are mainly 8 inches and 12 inches. The main processing methods of wafers are sheet processing and batch processing, that is, processing 1 piece at the same time. Or multiple wafers, as the semiconductor feature size becomes smaller and smaller, processing and measurement equipment become more and more advanced, resulting in new data characteristics in wafer proce...

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Problems solved by technology

[0003] For example, the Chinese patent discloses: wafer grinding equipment, publication number: CN111482865A, which carries and drives the wafer to rotate through the first shaft body of the vacuum chuck shaft mechanism, and the pressing part of the pressing mechanism abuts against the wafer to hold it Compressed on the first shaft body, the positioning part of the positioning mechanism can perform secondary positioning on the wafer before the pressing mechanism performs the pressing operation to ensure the concentricity of the wafer and the first shaft body, and the grinding machine of the grinding mechanism can move along the The axial and radial movement of the first shaft body enables the wafer grinding equipment to grind the outer peripheral surface of the wafer from top to bottom along the axial direction of the first shaft body (wafer), avoiding grinding wheel and wafer The contact area of ​​the round surface to be processed is too large, resulting in chipping and fragmentation of the wafer, while the conveying mechanism transfers the wafer between the storage unit and the first axis body, realizing fully automatic access and retrieval of the wafer. Positioning, pressing, and grinding process minimize manual intervention, ensure the stability of wafer processing, and improve wafer processing efficiency. However, the equipment has relatively large limitations in use and can only be used for wafers of the same size. For grinding, if the wafer specifications are different, the grinding equipment needs to be replaced, which increases the time required for grinding

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