Wafer grinding equipment for research and development of high-side NMOSFET driver chip

Abstract

The invention discloses wafer grinding equipment for research and development of a high-side NMOSFET driver chip. The wafer grinding equipment comprises a workbench, a rectangular groove is formed in the center of the end part of the workbench, a connecting rod is fixedly mounted on the side wall of the workbench, a first motor is fixedly mounted at the end part of the connecting rod, and a column sleeve is fixedly mounted at the end part of the first motor; a hydraulic rod is fixedly mounted on the side, away from the first motor, of the column sleeve, an adjusting column penetrates through the interior of the hydraulic rod, a first strip-shaped groove and a second strip-shaped groove are formed in the side wall of the workbench, an adjusting mechanism sleeves the surface of the adjusting column and comprises threaded sleeves, and the two threaded sleeves are symmetrically arranged with the midpoint of the adjusting column as the center point; and the surfaces of the two threaded sleeves are opposite in thread direction, the threaded sleeves are arranged on the surface of the adjusting column in a sleeving mode, a rotating cap is fixedly installed at the end of the adjusting column, and a rotating disc is fixedly installed on the side, away from the column sleeves, of the hydraulic rod, so that when the equipment is used, the distance of grinding sleeves can be adjusted at will, the equipment is suitable for wafers of any size, and the application range is wider.

Description

technical field

[0001] The present application relates to the technical field of wafer processing, and in particular to a wafer polishing equipment for research and development of high-side NMOSFET driver chips. Background technique

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical monocrystalline silicon. After grinding, polishing and slicing, silicon wafers are formed, that is, wafers. At present, domestic wafer production lines are mainly 8 inches and 12 inches. The main processing methods of wafers are sheet processing and batch processing, that is, processing 1 piece at the same time. Or multiple wafers, as the semiconductor feature size becomes smaller and smaller, processing and measurement equipment become more and more advanced, resulting in new data characteristics in wafer proce...

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