Heat conduction structure for heat dissipation of PE plate

Abstract

The invention discloses a heat conduction structure for heat dissipation of a PE plate, and belongs to the technical field of PE plates. High temperature at the PE plate can be transmitted and dissipated outwards by arranging a matching structure of a honeycomb heat conduction sheet and heat conduction cotton on the outer end face of the PE plate, a plurality of heat conduction columns are distributed on the upper end face of the honeycomb heat conduction sheet, and the multiple heat conduction columns are high in fixed-point heat conduction performance, and conduct heat to a heat dissipation plate in a centralized manner. When the temperature of the heat conduction columns is too high, a magnetic driving mechanism deforms and is separated from a pair of magnetic grating plates, and at the moment, the pair of magnetic grating plates slide downwards to be separated from a heat dissipation cavity under the gravity action of the magnetic grating plates, so that the conduction area between the heat conduction columns and the heat dissipation cavity is enlarged, the heat conduction columns embedded in the inner side communicate with the outside, so that the heat conduction and heat dissipation performance of the heat conduction columns is effectively improved, rapid cooling of the PE plate is achieved, and in the natural low-temperature state, the magnetic driving mechanism is connected with a pair of magnetic partition plates in a magnetic attraction mode, and sealing, dust prevention and moisture prevention of the heat dissipation cavity are achieved.

Description

technical field [0001] The invention relates to the technical field of PE plates, and more specifically, relates to a heat conduction structure for heat dissipation of PE plates. Background technique [0002] Polyethylene PE has the characteristics of high toughness, tensile strength, corrosion resistance, low temperature resistance, good electrical and dielectric insulation, low water absorption, low water vapor permeability, good chemical stability, non-toxic and harmless, and good wear resistance. It is widely used in chemical industry, clothing, packaging, food and other fields. [0003] However, PE sheet is very sensitive to environmental stress (chemical and mechanical action), and its heat aging resistance is poor. Under the action of heat, the internal fiber structure of polyethylene PE sheet is easy to change, thus affecting its mechanical properties. [0004] In order to enhance the heat resistance of the polyethylene PE board, the outer surface of the substrate l...

AI Technical Summary

Problems solved by technology

However, it is difficult for an ordinary layer of thermal conductive adhesive to quickly dissipate a large amount of heat, and the thermal conductive adhesive is sealed and bonded to the PE sheet, and the poor air permeability is not conducive to ventilation and heat dissipation, resulting in a decrease in the overall heat resistance

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