Electro-deposition copper foil post-treatment device
A post-processing device and electrodeposition technology, which is applied in electroforming, electrolysis process, electrolysis components, etc., can solve the problems that affect the dip soldering resistance index and anti-peeling strength, blackening of electrolytic copper foil, difficulty in removing oxide layer, etc.
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[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0022] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0023] refer to Figure 1-4 , the present invention provides a post-processing device for electrodeposited copper foil, comprising a mounting table 1, an electrolytic cell 3 is fixedly arranged on the mounting tab...
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