Glue spraying equipment for semiconductor photoetching processing

Abstract

The invention discloses glue spraying equipment for semiconductor photoetching processing. The equipment comprises a glue inlet and a nozzle pipe fixedly mounted at the bottom of the glue inlet; the bottom of the nozzle pipe is provided with a plurality of glue spraying openings; and the nozzle pipe is internally provided with an anti-blocking sealing element for adjusting the number of the glue spraying openings; a limiting piece is arranged above the end part of the anti-blocking sealing element;and the lower part of the anti-blocking sealing element is connected with an auxiliary device through a connecting piece; the side surface of the auxiliary device is provided with a discharging device to deal with excess sprayed glue outside a wafer; and a material collection device is arranged below the discharging device. According to the glue spraying equipment for the semiconductor photoetching processing, the number of the glue spraying openings in the nozzle pipe can be adjusted through the anti-blocking sealing element and the auxiliary device according to the outer diameter of the wafer; a positioning scraper on the auxiliary device can remove redundant sprayed glue on the outer side of the wafer while performing positioning, so that the glue spraying efficiency of the surface of the wafer is improved, edge exposure of the wafer in the subsequent process can be avoided, and the finished product efficiency of the wafer is effectively improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to glue spraying equipment for semiconductor photolithography processing. Background technique [0002] Photolithography is one of the important process methods in the semiconductor manufacturing process, which usually includes the following steps: forming a photoresist layer on the semiconductor wafer; selectively exposing the photoresist layer, and making the exposed light through a developing step The resist layer further forms a photoresist pattern, and this step is also called patterning of the photoresist layer; using the patterned photoresist layer as a mask, the semiconductor wafer is etched; After etching, the photoresist layer is ashed to remove the photoresist layer, and the photoresist layer can be formed by spray coating or spin coating. [0003] However, during the spin coating process of the existing glue spraying equipment, only a single concentrated nozzle s...

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Problems solved by technology

[0003] However, during the spin coating process of the existing glue spraying equipment, only a single concentrated nozzle sprays the glue and drives the wafer to rotate, so that the glue can be evenly covered on the wafer under the action of centrifugal force. The cycle is long, the efficiency is slow, and the photoresist under the action of centrifugal force is prone to edge exposure during post-processing, and when processing wafers of different sizes, the rotational centrifugal force of the wafer and the amount of glue sprayed by the nozzle also need to be adjusted accordingly. Affects the finished product efficiency of the wafer

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