Semiconductor heat treatment equipment

A kind of heat treatment equipment and semiconductor technology, which is applied in the direction of post-processing, semiconductor/solid-state device manufacturing, post-processing details, etc., and can solve problems such as process port sealing failure

Pending Publication Date: 2021-09-10
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the shortcomings of the existing methods, the present application proposes a semiconductor heat treatment equipment...

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  • Semiconductor heat treatment equipment
  • Semiconductor heat treatment equipment
  • Semiconductor heat treatment equipment

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Embodiment Construction

[0030] The present application is described in detail below, and examples of embodiments of the present application are shown in the drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Also, detailed descriptions of known technologies will be omitted if they are not necessary to illustrate the features of the present application. The embodiments described below by referring to the figures are exemplary only for explaining the present application, and are not construed as limiting the present application.

[0031]Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be u...

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Abstract

The embodiment of the invention provides semiconductor heat treatment equipment. The semiconductor heat treatment equipment is characterized in that the bottom wall of a heating chamber is provided with an installation opening communicated with a heating space, and a first groove is formed in the end, away from the heating space, of the installation opening; the outer process pipe extends into the heating space of the heating cavity, a heat dissipation boss is arranged on the peripheral wall of the bottom of the outer process pipe, and a process opening is formed in the bottom end of the outer process pipe; the bearing mechanism is hermetically connected with the process port and the bottom wall of the heating chamber through a sealing structure; and a second groove is formed in the top face of the bearing mechanism, the second groove and the first groove are matched to form a heat dissipation cavity, and the heat dissipation cavity is used for conducting heat dissipation on the heat dissipation boss. According to the embodiment of the invention, the semiconductor heat treatment equipment can be suitable for long-time high-temperature oxidation and other processes, and the maintenance time and the maintenance cost can be greatly reduced.

Description

technical field [0001] The present application relates to the technical field of semiconductor processing, and in particular, the present application relates to a semiconductor heat treatment equipment. Background technique [0002] At present, the high-temperature oxidation process of silicon carbide (SiC) is the key process of the third-generation semiconductor SiC device integrated circuit production line. SiC materials produce very dense silicon dioxide (SiO 2 ) film, but the diffusion coefficient of oxygen in SiO2 is very small, so the oxidation rate is low under normal conditions. Usually, the SiC high temperature oxidation process takes at least 4 hours, which is a long time compared to the silicon oxidation process. As the thickness of the oxide layer increases, the oxidation rate slows down, making the process time longer, and because the process temperature is as high as 1500°C, conventional materials cannot meet the process environment requirements such as high ...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/02C30B29/36C30B33/00C30B33/02
CPCH01L21/02164H01L21/02236H01L21/02255H01L21/67098C30B33/02C30B33/005C30B29/36
Inventor 陈志兵李旭刚
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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