Wafer wet etching equipment

Abstract

The invention discloses wafer wet etching equipment. The equipment comprises a storage container, and a main pipeline, a pressure relief pipeline, an auxiliary pipeline and a recovery pipeline which are respectively connected with the storage container; the main pipeline is connected with a pump, a heater and a flow meter; the pressure relief pipeline is connected with a pressure sensor and a pressure regulator; the storage container is used for storing an etching agent; the pump is used for pumping the etching agent in the storage container into the main pipeline; the heater is used for heating the etching agent to a preset temperature; the equipment further comprises a plurality of etching chambers used for etching the wafer; each etching chamber is connected with the main pipeline through a respective branch pipeline; and the equipment also comprises a control device used for controlling the etching process of each etching chamber.

Description

technical field [0001] The invention relates to the field of semiconductor integrated circuit manufacturing, in particular to a wafer wet etching equipment. Background technique [0002] In the manufacture of semiconductor devices, etching processes include dry etching and wet etching. In dry etching, the etching gas is usually fed into the etching chamber, and plasma is formed to form plasma (plasma), and then the etched material on the wafer, such as a silicon wafer, is etched. Wet etching uses an etching solution to etch the material to be etched on the wafer. [0003] With the continuous development of semiconductor technology, the process node, that is, the line width will continue to shrink, and the technology of line width restriction will make the process more and more difficult. In order to reduce the damage of the metal gate layer or the surface of the film (film), the existing dry etching The requirements for etching technology are becoming increasingly stringen...

AI Technical Summary

Problems solved by technology

[0005] At present, the high-temperature TMAH wet etching equipment mostly adopts single-chip etching equipment, and the equipment often consists of multiple etching chambers. When each chamber is operated at the same time, the etching rate of different chambers varies greatly.

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