Chip and cutting method thereof
A cutting method and chip technology, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as poor chip cutting
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Embodiment 1
[0029] see Figure 1 to Figure 2 , a chip cutting method, the present embodiment is applied to the cutting of UVC (short-wave ultraviolet) LED chips.
[0030] A chip cutting method, comprising the following steps:
[0031] Step 1. Chip preparation: several chips are prepared on the substrate 1 .
[0032] Step 1.1, grow AlN layer 2, N-type AlGaN layer 3, MQW layer 4, P-type AlGaN layer 5, and P-type GaN layer 6 sequentially on the sapphire substrate 1 through conventional processes to prepare UVC (short-wave ultraviolet) LED epitaxial wafers ;
[0033] Step 1.2, preparing an N electrode layer 9 on the N-type AlGaN layer 3 through an etching process and an electrode contact process on the LED epitaxial wafer;
[0034] Step 1.3: Prepare a current spreading layer 7 with a thickness of 1100A by sputtering or vapor deposition, and carry out alloy treatment on the current spreading layer 7 by means of RTA alloy. process to prepare the pattern of the current spreading layer 7; and...
Embodiment 2
[0052] The difference between this embodiment and embodiment 1 is that in step 2.1, the laser frequency used for the first laser cutting is 90 kHz.
Embodiment 3
[0054] The difference between this embodiment and Embodiment 1 is that in step 2.1, the laser frequency used for the first laser cutting is 110 kHz.
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