Fully-packaged internal insulation semiconductor device

Abstract

The invention discloses a fully-packaged internal insulation semiconductor device. The device comprises a semiconductor main body, a collector electrode pin, a base electrode pin, an emitter electrode pin, a first insulation inner shell, a second insulation inner shell, a limiting block, a positioning hole, a positioning column, a limiting groove, a limiting frame, a first heat conduction rubber sleeve, a second heat conduction rubber sleeve, a mortise, a tenon part, a groove, a convex block, a first insulation outer shell, a second insulation outer shell, a heat dissipation grid groove, a connecting lug plate, a connecting column, a connecting screw hole and a connecting screw. A sleeve hole, a rubber sleeve, a frame groove, a convex frame, a mounting plate and a mounting hole; according to the invention, a fully-packaged internal insulation structure is adopted, so that the problems of electric leakage and short circuit of the semiconductor device after the insulation layer is damaged are avoided. The working reliability of the semiconductor device is improved, the heat dissipation performance of the semiconductor device is improved, the overheating risk of the semiconductor device is reduced, and the service life of the semiconductor device is prolonged. The device is easy to disassemble after being installed. The maintenance and replacement are convenient, and maintenance cost of the semiconductor device is saved.

Description

technical field [0001] The invention relates to the technical field of semiconductor devices, in particular to a fully encapsulated internal insulating semiconductor device. Background technique [0002] A semiconductor device is an electronic device whose conductivity is between a good conductor and an insulator. It uses the special electrical properties of semiconductor materials to complete specific functions. It can be used to generate, control, receive, transform, amplify signals and perform energy conversion. The semiconductor material of semiconductor devices is silicon, germanium or gallium arsenide, which can be used as rectifiers, oscillators, light emitters, amplifiers, photometers and other equipment. In order to distinguish them from integrated circuits, they are sometimes called discrete devices. [0003] However, most traditional semiconductor devices adopt a semi-encapsulated external insulation structure, which is not only prone to leakage and short circuit ...

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Problems solved by technology

[0003] However, most traditional semiconductor devices adopt a semi-encapsulated external insulation structure, which is not only prone to leakage and short circuit problems due to damage to the external insulation layer, but also affects the poor reliability of the semiconductor device, and also affects the heat dissipation performance of the semiconductor device. The overheating risk of the device shortens the service life of the semiconductor device, and it is inconvenient to disassemble after installation, making maintenance and replacement difficult, which inevitably increases the maintenance cost of the semiconductor device

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