Ultrahigh-isotropy heat-conducting material of epoxy two-dimensional flaky metal nanofiller and preparation method of heat-conducting material

Abstract

The invention provides an ultrahigh-isotropy heat-conducting material of an epoxy two-dimensional flaky metal nanofiller and a preparation method of the heat-conducting material. The material mainly comprises the following components: epoxy resin, a two-dimensional sheet metal nanofiller, a two-dimensional sheet carbon series heat conduction filler and a diluent. The method comprises the following steps: uniformly mixing the components, removing the diluent, and preparing the heat-conducting material or a workpiece through a hot press molding process. The two kinds of two-dimensional sheet-shaped heat-conducting fillers are in lap joint in an epoxy resin matrix to form a three-dimensional heat-conducting network, efficient lap joint and efficient synergistic effect of the two-dimensional sheet-shaped metal nanofiller are achieved, the heat-conducting property of the obtained heat-conducting material or the workpiece is greatly improved, and the isotropic heat-conducting characteristic is achieved.

Description

technical field [0001] The invention belongs to the technical field of thermal conductive materials, and in particular relates to an ultra-high isotropic thermal conductive material of epoxy-based two-dimensional sheet metal nanofillers and a preparation method thereof. Background technique [0002] With the vigorous development of power density in the fields of microelectronics, optoelectronics, and energy harvesting, thermal management problems have become increasingly prominent. Insufficient heat dissipation will cause heat to accumulate in electronic devices, and overheating of electronic devices will shorten the service life of the device, cause damage to the device, or even cause a fire. Therefore, in such fields, thermal management problems need to be optimized and solved urgently. Therefore, the development of high-efficiency thermally conductive materials and the commercial application of this type of thermal interface materials are the keys to solving thermal mana...

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Problems solved by technology

[0007] It can be seen from the above that most of the current polymer composite thermal conductive materials filled with metal composite fillers utilize the synergistic effect of different thermal conductive fillers to a certain extent, but their thermal conductivity is still low, usually difficult to exceed 5W / m·K , and the heat conduction is usually anisotropic, and only one direction has good heat conduction performance, while the heat conduction performance in other directions is very poor, and it is difficult to meet higher heat conduction standards and requirements, thus limiting the use of materials Product shape specification and scope of application

In addition, in order to achieve better thermal conductivity, high-cost raw materials are usually selected, and the preparation method is relatively complicated, which is not suitable for the preparation of high-efficiency thermal interface materials that can be used commercially.

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