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Satellite cellular board sample preparation device

A technology of sample preparation and honeycomb plate, applied in the preparation of test samples, measuring devices, sampling, etc., can solve problems such as pressure changes, achieve low cost, good versatility, and improve sample preparation efficiency

Active Publication Date: 2021-09-24
SHANGHAI COMPOSITES SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The equipment inflates the airbag to generate pressure, and under the action of pressure and adhesive, the face plate, the bottom plate and the honeycomb core are bonded together to form, but when the design is cured at high temperature, the airbag is affected by the temperature, which will cause pressure on the honeycomb panel. Variety

Method used

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  • Satellite cellular board sample preparation device
  • Satellite cellular board sample preparation device
  • Satellite cellular board sample preparation device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] The present invention provides a honeycomb panel sample preparation device for satellites, comprising a base 1, a first adjustment assembly, a second adjustment assembly, a pressure plate 6 and a pressure sensor 13, the base 1 is provided with a first support structure, the The pressing plate 6 is installed on the first support structure through the first adjustment assembly, and a first accommodation space 15 is provided between the pressing plate 6 and the base 1, and the first accommodation space 15 is used to place the honeycomb panel sample 14, The pressure sensor 13 is arranged along the circumferential direction of the honeycomb panel sample 14 and is arranged in the first accommodation space 15. The pressure sensor 13 is preferably a digital display pressure sensor, and the sample preparation pressure can be determined by observing the readings of the digital display pressure sensor 13. Accurate control, this device can be applied to normal temperature curing and...

Embodiment 2

[0049] This embodiment is a preferred example of Embodiment 1.

[0050] In this example, if Figure 1 to Figure 5As shown, the first support structure includes four support rods 2, four washers 3, two beams 4 and four hex nuts 10, the bottom ends of the support rods 2 are preferably installed on the base 1 through threaded structures, and the bottom ends of the support rods 2 The top end passes through the washer 3 and the beam 4 in sequence and is fastened by the hex nut 10 to form two mutually symmetrical support frames arranged on both sides of the base 1 .

[0051] In this embodiment, the second support structure adopts a bottom brace 9, and the lower end of the bottom brace 9 is a spherical surface.

[0052] In this example, if figure 2 , image 3 As shown, the first adjustment assembly includes an adjustment rod 5, a spring cup seat 7, a spring pressure plate 8 and a spring 11, the bottom end of the spring cup seat 7 is connected to the pressure plate 6, and the inte...

Embodiment 3

[0056] This embodiment is another preferred example of Embodiment 1.

[0057] In this embodiment, the pressure area of ​​the honeycomb plate sample 14 is 0.02㎡, and the sample preparation pressure is 0.15MPa. When the readings of the four digital display pressure sensors 13 are all 750N, the pressure of the device reaches the sample preparation pressure. After measurement, the digital display pressure When the reading of the sensor 13 reaches 750N, the deformation of the force-bearing end is 0.1mm. Use a 0.10mm-0.12mm feeler gauge to evenly pad around the upper surface of the honeycomb panel sample 14, and cover the pressure plate 6 according to the pre-installed state.

[0058] In this embodiment, the sum of the weights of the pressing plate 6 , the spring cup holder 7 , the spring pressing plate 8 and the spring 11 is 52N. Slowly tighten the hexagon socket head cap screw 12 to drive the digital display pressure sensor 13 to move upward. In order to ensure that the four digit...

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Abstract

The invention provides a satellite cellular board sample preparation device which comprises a base, a first adjusting assembly, a second adjusting assembly, a pressing plate and pressure sensors, a first supporting structure is arranged on the base, the pressing plate is installed on the first supporting structure through the first adjusting assembly, a first accommodating space is arranged between the pressing plate and the base and is used for placing a cellular board sample, and the pressure sensors are arranged along the circumferential direction of the cellular board sample and are arranged in the first accommodating space; the second adjusting assembly is connected with the pressure sensors and is used for zeroing the pressure sensors; the first adjusting assembly can drive the pressing plate to move so as to adjust the cellular board sample to the set pressure. The preparation device can be used in a normal-temperature curing environment and can also be used in a high-temperature curing environment, and the preparation device is simple in structure, low in cost, convenient to mount and dismount and high in sample preparation efficiency.

Description

technical field [0001] The invention relates to the technical field of composite material assembly, in particular to a sample preparation device for a satellite honeycomb panel. Background technique [0002] As one of the most important structural parts of satellites, the structural strength of satellite honeycomb panels has an important impact on the operation of on-board equipment, the stability of the entire star structure and the service life of satellites. Honeycomb panels are mainly composed of upper and lower skins and honeycomb cores, which are bonded by adhesives to form an overall rigid structure. Therefore, the bonding performance of adhesives directly affects the structural strength of honeycomb panels. [0003] Due to the differences in batches of the adhesive itself, it is necessary to prepare samples to test its bonding performance before the adhesive is put into use. For the board-core bonding in the honeycomb structure, there are mainly two curing parameters...

Claims

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Application Information

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IPC IPC(8): G01N1/28
CPCG01N1/28G01N1/286
Inventor 秦洪远魏海旭刘图远李玲邵帅谢龙张兆坤杨昊铭杜松松王亚栋严忠黄国亮张团结
Owner SHANGHAI COMPOSITES SCI & TECH CO LTD
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