Method for etching and forming ITO substrate of liquid crystal screen

Abstract

The invention relates to the field of substrate processing, in particular to a liquid crystal screen ITO substrate etching forming method, a substrate etching forming device is used, the substrate etching forming device comprises a fixed frame, a movable frame and a tray, a supporting frame is arranged on the fixed frame, the movable frame is hinged to the top of the supporting frame, the movable frame is of a frame-shaped structure, springs are arranged on the two sides of the bottom of the movable frame, the bottoms of the springs are fixedly installed on the fixed frame, a sliding groove of an annular structure is formed in the bottom of the movable frame, a sliding block is slidably installed in the sliding groove, a supporting rod is arranged at the bottom of the sliding block, and a ball is rotationally connected to the end, away from the sliding block, of the supporting rod; and inclined plates are symmetrically arranged on the fixed frame and located below the sliding grooves, the inclined plates correspond to the balls respectively, a plurality of trays are arranged on the movable frame, and the trays are distributed in a mutually stacked mode. The method can automatically demold a plurality of base plates, the base plate demolding efficiency is greatly improved, and the method is suitable for popularization.

Description

Technical field [0001] The present invention relates to the field of substrate processing, and in particular, to a liquid crystal screen ITO substrate etching forming method. Background technique [0002] LCD screen is an electronic screen that belongs to a planar display, mainly used for screen display of televisions and computers. The advantage of the display is that the power consumption is low, small size, low radiation. [0003] During the manufacturing process of the LCD, it is necessary to use the ITO substrate, and the existing ITO substrate is mostly used in a way of etching, and the etching is the technique of using a chemical reaction or physical impact, etching technique. It is divided into wet etching and dry etching, and is generally used for most wet etching for the ITO substrate processing. When machining, it is necessary to cover the ITO film on the substrate, and will then cover the substrate of the ITO film is placed in advance ready-to-etching. Soak in the liq...

AI Technical Summary

Problems solved by technology

[0003] In the manufacturing process of LCD screens, ITO substrates are required, and most of the existing ITO substrates are processed by etching. Etching is a technology that removes materials using chemical reactions or physical impacts. Etching technology can It is divided into two types: wet etching and dry etching, and wet etching is generally used for ITO substrate processing. During processing, it is necessary to cover the substrate with ITO film, and then put the substrate covered with ITO film into the pre-prepared etching process. Soak in the liquid to make the etching liquid erode the substrate to achieve etching. After the substrate is etched, it is necessary to take out the substrate, clean it, and remove the ITO film. Most of the existing processing methods are manually processed. The etched substrate is stripped. This method is inefficient and has high labor costs, which is not conducive to the batch processing of the substrate. At the same time, manual stripping cannot guarantee the accuracy, and it is easy to cause damage to the substrate during the stripping process. This reduces the yield rate of the substrate, which brings inconvenience to the etching process of the ITO substrate

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