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Packaging tool and packaging process for fuze product

A technology of packaging technology and tooling, which is applied in the direction of sealed casings, electrical components, electrical equipment casings/cabinets/drawers, etc., can solve problems such as unsafe, cumbersome, and affecting product performance, achieve safety performance guarantee, enhance plugging effect, The effect of eliminating the cleaning process

Pending Publication Date: 2021-09-28
GUIZHOU AEROSPACE ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When encapsulating the circuit board in the cavity, at present, multi-component rubber materials such as polyurethane, silicone rubber or epoxy resin are basically used for mixing and cross-linking reaction curing for packaging. Improper measures will often cause the glue to flow to the part of the circuit board that does not need to be packaged, which will affect the product performance, and it will take a lot of time to remove the excess glue after curing, which is easy to produce excess and damage the product. not safe

Method used

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  • Packaging tool and packaging process for fuze product
  • Packaging tool and packaging process for fuze product
  • Packaging tool and packaging process for fuze product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] The technical solutions of the present invention will be described below, but the scope of claims is not limited to the above.

[0029] like figure 1 , figure 2 The modified product shown is composed of the casing 1, the circuit board 2, and the circuit board 2 is fastened to the casing 1 by the screw, in order to prevent the circuit board and the device damage or connection failure due to the impact, the circuit board is required. Perform a whole package. The cartridge 1, the intermediate portion of the circuit board 2 has a through chamber 3, and the casing 1 has a recess platform 4 and a ring groove 5 for encapsulating the electronic module. According to the currently conventional overall package method, the encapsulating rubber will flow into the cavity 3, the recess platform 4, the annular groove 5, and the reverse surface of the screw hole, which will affect the assembly and product performance of the product, and increase the elimination of extensive plastic The diff...

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PUM

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Abstract

The invention relates to a packaging tool and the packaging process for a fuze product. The packaging tool comprises a box body, a circuit board, a leaking stoppage tool and a sealing ring. According to the process method, the fuze product is packaged through the steps of packaging, vacuumizing, curing and the like which are matched with the packaging tool. According to the leaking stoppage tool and the process method, structural features and size are matched with a structural feature through cavity and concave platform in the middle of the fuze product, the effect of installing an electronic module after packaging can be simulated; meanwhile, by means of a sealing ring which is shaped and sized to be matched with the structural feature through cavity and concave platform and the leaking stoppage tool, so that the leaking stoppage effect is enhanced. such kind of mode can replace other adhesives to realize sealing; the sealing ring and the leaking stoppage tool can be repeatedly used, silicone grease or silicone rubber for leaking stoppage are not adopted, so that raw material cost is reduced, material consumption is reduced; and cleaning procedure is omitted, materials are saved, and the safety performance of a product is also guaranteed.

Description

Technical field [0001] The present invention belongs to the field of trusted assembly, and specific relates to packaging tools and packaging processes for the cartridge product. Background technique [0002] At present, most of the cartridges are mounted in the box and then packaged modular products, in order to ensure the normal operation of the cartridge product, prevent the circuit board and the device damage or connection failure due to the impact, and now general purpose The method is to encapsulate the circuit board in the cavity to reinforce the reinforcement. When the circuit board is encapsulated in the cavity, it is currently based on multi-component compound such as polyurethane, silicone rubber or epoxy resin to make a mixed crosslinking reaction curing, but since the fluidity of the rubber is very good, and due to plugging Improper measures often cause the rubber flow to the circuit board without the packaged portion, which affects product performance, and will spend...

Claims

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Application Information

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IPC IPC(8): H05K5/06B29C39/10B29C39/22B29C39/24B29C39/38
CPCH05K5/061H05K5/064B29C39/10B29C39/22B29C39/24B29C39/38
Inventor 潘静
Owner GUIZHOU AEROSPACE ELECTRONICS TECH
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