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Heat conduction component and method for manufacturing heat conduction component

A technology for heat conduction components and manufacturing methods, which are applied in the directions of semiconductor/solid-state device parts, manufacturing tools, semiconductor devices, etc., and can solve the problems of difficulty in bonding, increase in melting temperature of solder, etc.

Inactive Publication Date: 2021-10-01
CHAUN CHOUNG TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, depending on the material of the plates to be joined, the melting temperature of the solder may increase, making joining difficult.

Method used

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  • Heat conduction component and method for manufacturing heat conduction component
  • Heat conduction component and method for manufacturing heat conduction component
  • Heat conduction component and method for manufacturing heat conduction component

Examples

Experimental program
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Embodiment Construction

[0021] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the drawings. In this specification, the heat conduction member 100 has a rectangular shape in plan view, and the bottom plate portion 1 and the top plate portion 2 overlap each other in the direction of gravity. Let the direction in which the bottom plate part 1 and the top plate part 2 overlap be Z direction. In addition, let the short side direction when seeing the heat conduction member 100 along the Z direction be X direction, and let the long side direction be Y direction. In addition, the size, shape, and size relationship between structural elements in the drawings are examples, and are not necessarily the same as the actual size, shape, and size relationship between structural elements.

[0022]

[0023] figure 1 It is a perspective view of the heat conduction member 100 of this invention. figure 2 yes figure 1 A cross-sectional view of the thermally...

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PUM

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Abstract

The invention provides a heat conduction component and a method for manufacturing the heat conduction component The heat conduction component comprises a shell in which a working medium is sealed, and the shell comprises solder as well as a bottom plate part and a top plate part which overlap each other vertically. At least one of the bottom plate part and the top plate part is made of a material comprising any of stainless steel, titanium and a titanium alloy. The top plate part has an inclined part, and the inclined part is connected to the inner side of the outer edge part and is away from the bottom plate part from the outer edge part to the inner side. The outer edge part of at least one of the bottom plate part and the top plate part is provided with a groove which is recessed in the vertical direction from the surface making contact with the solder. The groove is continuous along an outer edge of the shell. At least one part of the solder is arranged in the groove.

Description

technical field [0001] The present invention relates to a heat-conducting member and a method of manufacturing the heat-conducting member. Background technique [0002] In the conventional steam chamber, a space surrounded by the inner surfaces of two boards is formed. Furthermore, a core is accommodated inside the space, and a working fluid is enclosed in the space (for example, refer to JP-A-2018-004177). [0003] In the vapor chamber, the working fluid is evaporated by the heat received from the heat-generating components. The evaporated working fluid flows inside the container. In the core, the working fluid is cooled by external heat to condense. In the core, the condensed working fluid moves back to the heated part. In this way, the vapor chamber transports the heat transferred from the components. [0004] Patent Document 1: Japanese Patent Laid-Open No. 2018-004117 [0005] In the existing steam chamber, the plates are brazed together. In the case of brazing, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04H01L23/427B23K1/00B23K101/14
CPCF28D15/0266F28D15/04H01L23/427B23K1/0008B23K2101/14
Inventor 花野雅昭石田淳一奥田健巽昭生井冈英俊
Owner CHAUN CHOUNG TECH