Heating and cooling device of bonding machine

Abstract

The invention relates to the technical field of bonding machines, in particular to a bonding machine heating and cooling device; the bonding machine heating and cooling device comprises a top seat and a bottom seat which are arranged up and down, the side end of the bottom seat is fixedly connected with a second heating and cooling seat matched with a first heating and cooling seat, and a conveying mechanism is arranged between the first heating and cooling seat and the second heating and cooling seat. The first heating and cooling seat is connected with a transmission mechanism, the transmission mechanism comprises a first rack and a gear set, the conveying mechanism comprises a push block and a second rack, and the first rack drives the second rack through the gear set to drive the push block to reciprocate between the base and the second heating and cooling seat. Through cooperation of the first rack, the gear set, the second rack and the push block, after wafer bonding is completed, the push block pushes the bonded wafer out of the second heating and cooling seat along with upward movement of the first heating and cooling seat, automatic taking-out of the wafer is achieved, the scalding danger coefficient in the wafer taking-out process is greatly reduced, and safety is higher.

Description

technical field [0001] The invention relates to the technical field of bonding machines, in particular to a bonding machine heating and cooling device. Background technique [0002] A bonding machine is an instrument used in the field of physics. Wafer bonding technology can bond wafers of different materials together. Wafer bonding is an important process for three-dimensional processing of semiconductor devices. The main process steps of wafer bonding include wafer surface treatment, wafer alignment and final wafer bonding. Through these process steps, individual single wafers are aligned and then bonded together to achieve their three-dimensional structure. The bonding machine needs to put the materials to be bonded between two heated plates, and then apply external conditions such as pressure, temperature, and voltage to bond the materials together through van der Waals force, molecular force, or even atomic force. Therefore, pressure and temperature are two important ...

AI Technical Summary

Problems solved by technology

[0004] (1) After the wafer bonding is completed, the wafer needs to be taken out, but the heating and cooling device is difficult to cool down quickly, resulting in a certain risk of burns when taking out the wafer

[0005] (2) When the heating and cooling device is self-cooling, it generally uses its internal cooling structure for cooling to achieve gradual cooling from the inside to the outside, and the cooling time is longer

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