Heating and cooling device of bonding machine

A technology of cooling device and bonding machine, which is applied in the field of bonding machine, can solve the problems of long cooling time, scald when taking out the wafer, and difficulty in heating and cooling devices, and achieve the effects of high safety, accelerated cooling speed, and improved cooling effect

Active Publication Date: 2021-10-01
烟台一诺电子材料有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] (1) After the wafer bonding is completed, the wafer needs to be taken out, but the heating and cooling device is difficult to cool down quickly, resulting in a certain risk of burns when taking out the wafer

Method used

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  • Heating and cooling device of bonding machine
  • Heating and cooling device of bonding machine
  • Heating and cooling device of bonding machine

Examples

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Example Embodiment

[0047] Example 2:

[0048] A bonding machine heating cooling device according to the first embodiment of the present application, and a second embodiment of the present application proposes another bonding machine heating cooling device. The second embodiment is merely a preferred manner of the first embodiment, and the implementation of the second embodiment will not affect the separate implementation of the first embodiment.

[0049] By the following Figure 7 - Figure 9 The second embodiment of the present invention will be further described with reference to the second embodiment of the present invention.

[0050] The upper side of the push block 5 is provided with a heat dissipation plate one 31, and the lower end of the push block 5 is fixedly connected to the heat dissipation plate 2 42, and the heat dissipation plate 2 42 can be fixed in the form of a push block 5 in the form of a point contact to ensure that the air cooling is guaranteed. The heat dissipation plate one 31 ...

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Abstract

The invention relates to the technical field of bonding machines, in particular to a bonding machine heating and cooling device; the bonding machine heating and cooling device comprises a top seat and a bottom seat which are arranged up and down, the side end of the bottom seat is fixedly connected with a second heating and cooling seat matched with a first heating and cooling seat, and a conveying mechanism is arranged between the first heating and cooling seat and the second heating and cooling seat. The first heating and cooling seat is connected with a transmission mechanism, the transmission mechanism comprises a first rack and a gear set, the conveying mechanism comprises a push block and a second rack, and the first rack drives the second rack through the gear set to drive the push block to reciprocate between the base and the second heating and cooling seat. Through cooperation of the first rack, the gear set, the second rack and the push block, after wafer bonding is completed, the push block pushes the bonded wafer out of the second heating and cooling seat along with upward movement of the first heating and cooling seat, automatic taking-out of the wafer is achieved, the scalding danger coefficient in the wafer taking-out process is greatly reduced, and safety is higher.

Description

technical field [0001] The invention relates to the technical field of bonding machines, in particular to a bonding machine heating and cooling device. Background technique [0002] A bonding machine is an instrument used in the field of physics. Wafer bonding technology can bond wafers of different materials together. Wafer bonding is an important process for three-dimensional processing of semiconductor devices. The main process steps of wafer bonding include wafer surface treatment, wafer alignment and final wafer bonding. Through these process steps, individual single wafers are aligned and then bonded together to achieve their three-dimensional structure. The bonding machine needs to put the materials to be bonded between two heated plates, and then apply external conditions such as pressure, temperature, and voltage to bond the materials together through van der Waals force, molecular force, or even atomic force. Therefore, pressure and temperature are two important ...

Claims

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Application Information

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IPC IPC(8): H01L21/67B23P11/02
CPCH01L21/67109H01L21/67092B23P11/025
Inventor 林良高琪王岩王婷杜金源
Owner 烟台一诺电子材料有限公司
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