High-fluidity and low-viscosity epoxy resin composition and preparation method thereof

Abstract

The invention belongs to the technical field of C08L63 / 00, and particularly relates to a high-fluidity and low-viscosity epoxy resin composition and a preparation method thereof. The high-fluidity and low-viscosity epoxy resin composition at least comprises the following preparation raw materials: epoxy resin, a curing agent, an inorganic filler, a modifier and a flame retardant. The high-fluidity and low-viscosity epoxy resin composition prepared by the invention is green and environment-friendly, is safe and pollution-free in the use process, and meets the environment-friendly requirement; and when the high-fluidity and low-viscosity epoxy resin composition prepared by the invention is used in electronic components, high temperature can be borne, and the problems of insufficient filling and line punching can be avoided.

Description

technical field [0001] The invention belongs to the technical field of C08L63 / 00, and more specifically relates to a high-fluidity, low-viscosity epoxy resin composition and a preparation method thereof. Background technique [0002] The vigorous development of the information technology industry promotes the rapid development of the semiconductor industry, and promotes the rapid development of electronic packaging testing and materials. The development trend of miniaturization and high density of electronic components and the increasing market demand, on the one hand, promote the development of packaging forms to high integration, miniaturization of wiring, large-scale and thinner chips, and on the other hand, keep the packaging form unchanged. In this case, increase the lead frame density to improve production efficiency. [0003] In order to improve production efficiency and reduce production costs, more and more researchers in the packaging industry are researching high...

AI Technical Summary

Problems solved by technology

For example, SOT packaging has achieved mass production of 24 rows and 27 rows, and the diameter of the lead can be reduced to 18 μm, but the conventional epoxy molding compound will have problems of insufficient filling and punching during use, which cannot meet normal use.

[0004] The Chinese invention patent with the publication number CN107446316A discloses an epoxy molding compound composition, an epoxy molding compound and a preparation method thereof. Epoxy molding compounds prepared from flame retardants and fillers, but the fillers used in the published patents are D50 particle sizes of 2-8 μm and 15-35 μm, and there is still the problem of insufficient filling during use

[0005] The Chinese invention patent with the publication number CN112980053A discloses a thermally conductive filler for epoxy molding compound and its preparation method, and epoxy molding compound. Epoxy molding compound is prepared with thermally conductive filler of aluminum particles, but the content of thermally conductive filler is 55-90%, and the prepared epoxy molding compound may have a poor balance between fluidity and viscosity

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