Semiconductor equipment and semiconductor process method

Abstract

The invention provides semiconductor equipment and a semiconductor process method. The equipment comprises a tray, ejector pins and an air injection device, wherein a plurality of through holes penetrating through the tray are formed in the tray, and the ejector pins are arranged in the through holes in a one-to-one correspondence mode and can move up and down in the through holes; the air injection device is communicated with an air source and comprises a plurality of first air injection pipes and a plurality of second air injection pipes, the plurality of first air injection pipes are located below the ejector pins in a one-to-one correspondence mode, the plurality of second air injection pipes are located below the tray, and the heights of the tray and the ejector pins are changed by changing the air flow in the first air injection pipes and the air flow in the second air injection pipes. The air-induced suspension structure is creatively used for replacing a traditional stepping mechanical transmission structure, and the distance between the tray and the ejector pin can be changed by adjusting the flow of air for lifting according to process requirements, so that the distance between the tray and the substrate is changed; the problems of process pollution and the like easily caused by a mechanical transmission mode can be effectively avoided while the process uniformity is improved, and the process yield can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor device and a semiconductor process method. Background technique [0002] Vapor deposition is a technique for forming a functional film on the surface of a substrate. It uses the physical and / or chemical reactions of substances in the gas phase to deposit a single-layer or multi-layer, single-substance or compound film on the surface of the substrate. Make the surface of the product obtain various excellent properties required. As a surface coating method, vapor deposition is a basic step of vaporizing the material to be plated, transporting it, and finally depositing it. Its main feature is that no matter whether the original material to be plated is solid, liquid or gas, it is transported. It must be transformed into a gas phase form for migration, and finally reach the surface of the workpiece for deposition and condensation. During the vap...

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Problems solved by technology

[0003] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a semiconductor device and a semiconductor process method, which is used to solve the problem in the prior art that most of the transmission mechanisms in reaction chambers such as vapor deposition chambers are mechanical transmissions. Structure, the mechanical transmission structure will bring the risk of mechanical wear and oil leakage, which in turn will bring problems such as the risk of particle and oil leakage pollution to chip manufacturing

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