Flexible circuit board and preparation method thereof

Abstract

The invention discloses a preparation method of a flexible circuit board, and the method comprises the steps: (1) preparing a conductive copper layer on the surface of a carrier layer which comprises a substrate layer and a stripping layer, preparing the conductive copper layer on the surface of the stripping layer, and carrying out the etching of the conductive copper layer, and forming a circuit layer; (2) forming a feeding roll by the carrier layer and the circuit layer; (3) unwinding the two feeding rolls through the two unwinding devices correspondingly, and feeding the two feeding rolls between the two symmetrically-arranged hot pressing devices correspondingly; feeding a low-dielectric material into a screw injection molding machine, feeding the processed molten material between the two circuit layers, and performing hot pressing to form an insulating layer; and preparing a thickened copper layer on the surface of the circuit layer after stripping the carrier layer. According to the process, a thin copper layer can be obtained, thin copper is prevented from being easily broken due to tension, etching is facilitated, and a small-line-width circuit board is obtained; in addition, binding force between the copper layer and the insulating layer can be improved, high temperature resistance and heat resistance are achieved, the process is simple, cost is low, and production efficiency and yield can be improved.

Description

technical field [0001] The invention relates to the technical field of preparation of flexible circuit boards, in particular to a flexible circuit board and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of the electronics industry, printed circuit boards (PCB for short) have played a key connection and support role in electronic components. With the development of 5G communication, there is an urgent need for circuit boards in terms of high frequency, low transmission loss, high density, and high integration. High-frequency flexible flexible circuit boards of low-dielectric materials are mainly used on FPC antenna boards for high-frequency signal transmission, and terminals are used in 5G mobile phones, Internet of Things, smart homes, unmanned driving, VR technologies, etc. At present, for the preparation of circuit boards, polyimide film, polyester film, etc. are usually used as substrates, and then copper foil or ...

AI Technical Summary

Problems solved by technology

However, the bonding force between the insulating base material and the copper layer obtained by this manufacturing method is insufficient, causing the copper layer to be easily detached, which affects the quality of the product. At the same time, the high temperature resistance and heat resistance are weak, which is not suitable for the development of the 5G industry.

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