Heat dissipation circuit board and preparation method thereof

Abstract

The invention discloses a preparation method of a heat dissipation circuit board, and the method comprises the following steps: (1) preparing a conductive copper layer on the surface of a carrier layer which comprises a base material layer and a stripping layer, and etching the conductive copper layer to form a circuit layer; (2) forming a feeding roll by the carrier layer and the circuit layer; (3) feeding a heat-conducting rubber material into the surface of a feeding roll, drying the heat-conducting rubber material by a drying device, attaching the heat-conducting rubber material to the first heat-dissipating layer and the second heat-dissipating layer, jointly feeding the heat-conducting rubber material between two hot-pressing devices for hot-pressing, forming a heat-conducting insulating layer between the first heat-dissipating layer and the conductive copper layer after the heat-conducting rubber material is hot-pressed, wherein a first winding device is used for winding a carrier layer, and a second winding device is used for winding the product; and preparing a thickened copper layer on the surface of the circuit layer after stripping the carrier layer. According to the process, the circuit board of which the copper layer and the heat-conducting insulating layer have good binding force can be manufactured, the heat dissipation effect is good, the process is simple, the cost is low, and the production efficiency and the yield can be improved.

Description

Technical field [0001] The present invention relates to the preparation of the circuit board, and more particularly to a heat sink circuit board and a preparation method thereof. Background technique [0002] PCB (Printed Circuit Board) is a printed circuit board, referred to as a printing board, is one of the important components of the electronics industry. Almost every electronic device, small to electronic watches, calculator, large to computer, communication electronic equipment, military system, as long as there is an electronic component such as integrated circuit, in order to make the electrical interconnection between the components, printing plate. The printed circuit board consists of a pad of insulating substrate, a connection wire, and a welded electronic component, has a dual role of conductive lines and insulating substrates. It can replace complex wiring, realize electrical connections between components in the circuit not only simplify the assembly of electronic ...

AI Technical Summary

Problems solved by technology

LED is called the fourth-generation lighting source or green light source. It has the characteristics of energy saving, environmental protection, long life and small size. It is widely used in various indications, displays, decorations, backlights, general lighting and urban night scenes. Different functions, it can be divided into information display, signal lights, vehicle lamps, and general lighting. The LEDs in the prior art have the problem of heat dissipation of the circuit board, and the heat dissipation speed is slow, which cannot play a good role in the circuit board. Protective effects

In the traditional heat dissipation circuit board, it is generally composed of copper foil layer, thermal insulating layer and aluminum plate, but when the thermal conductive insulating layer and copper foil layer are pressed together, delamination and fracture are prone to occur. At the same time, the obtained thermal conductive insulating layer and the Insufficient bonding force of the copper foil layer leads to the easy detachment of the copper layer, which affects the quality of the product

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