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Manual eutectic die bonding device, system and method

A patch device and eutectic patch technology, which is applied in the manufacture of electrical components, electric solid devices, semiconductor/solid state devices, etc., can solve the problems of poor quality of eutectic patch and complex structure of automatic chip mounter, etc. To achieve the effect of simple structure, ensuring safety and improving quality

Active Publication Date: 2021-10-19
NO 24 RES INST OF CETC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of this, the purpose of the present invention is to provide a simple structure manual eutectic placement device, on the one hand to solve the technical problem of complex structure of the automatic placement machine, on the other hand to solve the technical problem of poor quality eutectic placement , to provide a solution to the production problem of small batches and multiple varieties of chips

Method used

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  • Manual eutectic die bonding device, system and method
  • Manual eutectic die bonding device, system and method
  • Manual eutectic die bonding device, system and method

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Embodiment Construction

[0054] The following will be further described below with reference to the specific embodiments:

[0055] like figure 1 , image 3As shown, the manual eutectic patch system includes a manual eutectic patch device including a bottom plate 100, a substrate 100 disposed on a parallelial preheating chamber 200 and an eutectry chamber 300; preheating The preheating platform 210 is provided in the chamber 200, and the first heating unit 220 heating the preheating platform 210, and the eutectry chamber 300 is provided, and the second heating unit 320 heated to the eutectic platform 310; preheating The chamber 200 is provided with a first nitrogen injection unit that is injected into nitrogen into the preheating platform 210, and a second nitrogen gas injection unit in which nitrogen gas is injected into nitrogen in the eutectic platform 310 is provided. In this application, the bottom plate 100 is the common bottom plate of the preheating chamber 200 and the eutectic chamber 300, which ca...

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Abstract

The invention relates to the field of eutectic die bonding, and particularly discloses a manual eutectic die bonding device, system and method. The manual eutectic die bonding device comprises a preheating chamber and an eutectic chamber which are arranged side by side, wherein a preheating platform and a first heating unit for heating the preheating platform are arranged in the preheating chamber, and an eutectic platform and a second heating unit for heating the eutectic platform are arranged in the eutectic chamber; and a first nitrogen injection unit for injecting nitrogen into the preheating platform is arranged on the preheating chamber, and a second nitrogen injection unit for injecting nitrogen into the eutectic platform is arranged on the eutectic chamber. The invention aims to provide the manual eutectic die bonding device which is simple in structure, on one hand, the technical problem that a full-automatic chip mounter is complex in structure is solved, on the other hand, the technical problem that eutectic die bonding quality is poor is solved, and a solution is provided for production of small-batch and multi-variety chips.

Description

Technical field [0001] The present invention relates to the field of eutectic patches, and a manual eutectic chip device, system, and method are disclosed. Background technique [0002] The eutectic chip process is to form a welded layer by metal alloy solder, and the chip is welded to the corresponding carrier. [0003] At present, although the fully automatic patch machine is already very mature, it is widely used, but the fully automatic sticker is complicated, the cost is higher, and the demand for the eutectic patch of the chip of small batch multi-varieties, does not have Advantage. In addition, the existing eutectic patch devices are prone to temperature instability when patch, and cannot fully protect the quality of the eutectic patches. Inventive content [0004] In view of this, it is an object of the present invention to provide a structure-simple manual eutectic patch device, and solve the technical problem of fully automatic spatch machine structure, and solve the t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60
CPCH01L24/75H01L24/83H01L2224/752H01L2224/759H01L2224/83048
Inventor 陶怀亮尹超李双江李金龙江凯王旭光
Owner NO 24 RES INST OF CETC
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