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Low-dielectric epoxy adhesive and preparation method thereof

A technology of epoxy glue and low dielectric, which is applied in the direction of epoxy glue, adhesive, adhesive type, etc., can solve the problems of high dielectric constant and dielectric loss, and achieve low dielectric constant, high room temperature and Effect of High Temperature Adhesive Strength

Active Publication Date: 2021-10-22
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The high dielectric constant and dielectric loss of commonly used epoxy adhesives cannot meet the requirements.

Method used

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  • Low-dielectric epoxy adhesive and preparation method thereof
  • Low-dielectric epoxy adhesive and preparation method thereof

Examples

Experimental program
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specific Embodiment approach 1

[0022] A preparation method of low-dielectric epoxy glue, comprising the steps of:

[0023] Step 1. Take 50 parts of bisphenol F epoxy resin and 40 parts of bisphenol E cyanate in parts by weight, and blend them evenly;

[0024] Step 2. Weigh 10 parts of bisphenol F epoxy resin in parts by mass, add 1 part of 2-ethyl-4-methylimidazole, and stir evenly;

[0025] Step 3: Mix the resins in Step 1 and Step 2 evenly to prepare a low-dielectric epoxy glue.

[0026] A low-dielectric epoxy adhesive prepared in this embodiment is used for dielectric samples. The sample size is φ25mm×2mm. The curing process is 100°C for 12 hours, and then 150°C for 12 hours.

specific Embodiment approach 2

[0028] A preparation method of low-dielectric epoxy glue, comprising the steps of:

[0029] Step 1. Weigh 50 parts of bisphenol F epoxy resin and 40 parts of bisphenol E cyanate in parts by weight, blend them evenly, then add 20 parts of EXL2691 core-shell particles, and put them in a high-speed disperser at 5000-13000r / Min speed dispersion 3 ~ 10min;

[0030] Step 2. Weigh 10 parts of bisphenol F epoxy resin in parts by weight, add 1 part of 2-ethyl-4-methylimidazole, and stir evenly;

[0031] Step 3: Mix the resins in Step 1 and Step 2 evenly to prepare a low-dielectric epoxy adhesive.

[0032] A low-dielectric epoxy adhesive prepared in this embodiment is used for dielectric samples, the sample size is φ25mm×2mm, and the specimen is bonded. The curing process is 100°C for 12h, and then 150°C for 12h.

specific Embodiment approach 3

[0034] A preparation method of low-dielectric epoxy glue, comprising the steps of:

[0035] Step 1. Weigh 50 parts of bisphenol F epoxy resin and 40 parts of bisphenol E cyanate in parts by weight, blend them evenly, then add 30 parts of EXL2691 core-shell particles, and put them in a high-speed disperser at 10000-13000r / Min speed dispersion 3 ~ 10min;

[0036] Step 2. Weigh 10 parts of bisphenol F epoxy resin in parts by weight, add 1 part of 2-ethyl-4-methylimidazole, and stir evenly;

[0037] Step 3: Mix the resins in Step 1 and Step 2 evenly to prepare a low-dielectric epoxy adhesive.

[0038] A low-dielectric epoxy adhesive prepared in this embodiment is used for dielectric samples, the sample size is φ25mm×2mm, and the specimen is bonded. The curing process is 100°C for 12h, and then 150°C for 12h.

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Abstract

The invention discloses a low-dielectric epoxy adhesive and a preparation method thereof, and belongs to the field of adhesives. The technical problem to be solved by the invention is to improve the dielectric property of the adhesive. The adhesive is prepared from the following components in parts by weight: 10-40 parts of cyanate resin, 90-60 parts of epoxy resin A, 0-5 parts of an epoxy diluent, 5-30 parts of a toughening agent, 0-10 parts of a thixotropic agent, 0-140 parts of a filler, 5-10 parts of epoxy resin B and 0.5-5 parts of a catalyst. The cyanate ester modified epoxy resin paste (paste) adhesive is prepared by taking epoxy resin as matrix resin, adding a small amount of cyanate ester for modification and adopting a non-metal compound as a catalyst, and the adhesive has the advantages of low dielectric constant, low dielectric loss tangent tan[delta], excellent adhesive property, high peeling strength and heat resistance.

Description

technical field [0001] The invention belongs to the field of adhesives; in particular, it relates to a low-dielectric epoxy adhesive and a preparation method thereof. Background technique [0002] Low-dielectric epoxy resins and adhesives are widely used in printed circuit boards, low-dielectric composite materials and other fields. The dielectric constant ε of epoxy resin and adhesive under high-frequency conditions (10GHz) is 3.0-3.4, and the dielectric loss tangent tanδ is 0.010-0.030. The high dielectric constant and dielectric loss of commonly used epoxy adhesives cannot meet the requirements. [0003] The main methods to improve the dielectric properties of epoxy are: First, optimize the curing process, increase the curing degree of the material, make the resin form a more uniform network structure, and effectively limit the polar groups in the structure. The second is to hybridize with low dielectric inorganic materials, such as silicon dioxide, silsesquioxane, etc....

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J11/08
CPCC09J163/00C09J11/08C08L2205/03C08L2205/025C08L2203/20C08L2201/08C08L63/00C08L79/04
Inventor 朱金华王莹刘晓辉荣立平樊慧娟赵颖王刚张大勇李欣米长虹
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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