Miniature coaxial transmission line based on 3D printing and manufacturing method of transmission line

Abstract

The invention provides a miniature coaxial transmission line based on 3D printing and a manufacturing method of the transmission line. A transmission line middle body (101) comprises an inner conductor (201), an outer conductor (202), a supporting structure (203), an outer frame cap (204) and an outer frame bottom plate (205), and the supporting structure (203), the outer frame cap (204) and the outer frame bottom plate (205) are all made of light-cured resin; the inner surface of the outer frame bottom plate (205) is covered with the outer conductor (202); the supporting structure (203) is located over the center of the outer frame bottom plate (205), and the upper surface of the supporting structure (203) is covered with the inner conductor (201); the outer frame cover cap (204) is inversely buckled on the outer frame bottom plate (205); and a transmission line end part (102) is positioned at the end part of the transmission line middle main body (101) and is hollowed out relative to the top of the transmission line middle main body (101). The micro coaxial transmission line provided by the invention takes photocuring 3D printing as the core, and has the advantages of convenience in batch manufacturing, short manufacturing period, high processing precision and the like compared with the manufacturing of a current micro coaxial structure.

Description

technical field [0001] The invention belongs to the field of 3D printing, and in particular relates to a micro-coaxial transmission line based on 3D printing technology and a manufacturing method thereof. Background technique [0002] The transmission of microwave signals in radio frequency electronic systems is the key. At present, the interconnection between chips mostly adopts horizontal or vertical transmission structures such as microstrip lines, striplines, coplanar waveguides, and vertical vias. In recent years, the demand for high-frequency applications has become prominent. With the rapid development of microwave integrated circuit technology, radio frequency systems are evolving towards miniaturization and high density. When the system integration level or frequency is very high, traditional interconnection and transmission technologies expose many disadvantages, such as large insertion loss and inter-line coupling. There is an urgent need for a new radio frequency...

AI Technical Summary

Problems solved by technology

CN202010430174.7 patent document adopts metal 3D printing method to make internal and external conductors. The metal 3D printing method is a one-dimensional printing method. The cycle of scale structure and batch processing is long and the cost is high, and the processing accuracy is not suitable for millimeter-level or submillimeter-level coaxial Fabrication of the structure

The CN202010039385.8 patent document is based on silicon-based micro-molds made by semiconductor technology, and uses micro-electroforming technology to make micro-coaxial structures. Although this method has high processing accuracy and can reach micron levels, the silicon mold manufacturing process is complicated and disposable. , leading to complex fabrication process and high cost of micro-coaxial structure

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