Reinforcing ring and surface packaging assembly
A surface encapsulation and reinforcing ring technology, applied in electrical components, electrical solid devices, semiconductor devices, etc., can solve the problems of fatigue failure, repeated thermal stress of solder balls, etc.
Pending Publication Date: 2021-10-29
HUAWEI MACHINERY
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
The difference in CTE between the FCBGA chip, the substrate and the PCB board will also cause the solder balls to be subjected to repeated thermal stress for a long time during the use of the chip, and there is a risk of fatigue failure
Method used
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[0050] In order to make the purpose, technical solution and advantages of the application clearer, the application will be further described in detail below in conjunction with the accompanying drawings.
[0051] Firstly, explain the application scenarios of the reinforcement ring disclosed in this application. The reinforcement ring provided in the embodiment of this application is applied to surface mount components, such as Figure 1a as shown in Figure 1a The structure of the surface mount assembly in the prior art is exemplified. The surface mount assembly includes a substrate 2 and a chip 1 disposed on the substrate 2. The chip 1 is soldered to the substrate 2 through a pad and bonded to the substrate 2 through an adhesive. then fixed. When the surface mount component is soldered on the PCB 3 , the substrate 2 will be warped due to temperature. Such as Figure 1b and Figure 1c As shown, when the reinforcement ring is not included, the surface mount component will w...
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Abstract
The invention provides a reinforcing ring and a surface packaging assembly. The reinforcing ring is used for correcting substrate warping of the surface packaging assembly, and the reinforcing ring is used for correcting substrate warping of the surface packaging assembly, wherein the reinforcing ring comprises an annular reinforcing ring main body, and an adjusting block, wherein the adjusting block and the reinforcing ring body are arranged on the same layer, and the adjusting block is fixed to at least one corner of the reinforcing ring body. The thermal expansion coefficient of the adjusting block is less than that of the reinforcing ring main body; through the cooperation of the adjusting block and the reinforcing ring main body, the M-shaped overpressure phenomenon of the reinforcing ring on the buckling deformation of the substrate at a high temperature is improved, the warping condition of the substrate is improved, and the flatness of the surface packaging assembly is improved.
Description
[0001] This application claims the priority of the Chinese patent application with the application number 202010348428.0 and the application name "A Reinforcing Ring and Surface Mounting Component" submitted to the China Patent Office on April 28, 2020, the entire contents of which are incorporated by reference in this application middle. technical field [0002] The present application relates to the technical field of surface mount components, in particular to a reinforcement ring and a surface mount component. Background technique [0003] Ball Grid Array (BGA) packaging is a packaging technology used for integrated circuits. The pins are ball-shaped and arranged in a grid to cover (or partially cover) the bottom of the packaging substrate (Packaging Substrate). When the chip is working, the electrical signal is transmitted from the chip integrated circuit to the printed circuit board (Printed Circuit Board, PCB) through the pins, and the pins are usually tin alloy solder...
Claims
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IPC IPC(8): H01L23/16H01L23/10H01L23/31
CPCH01L23/16H01L23/10H01L23/3128H01L23/562H01L2224/16227H01L2224/32225H01L2224/73204H01L2924/15311H01L2224/131H01L24/13H01L24/16H01L24/32H01L24/73H01L2924/3511H01L2224/81815H01L24/81H01L2924/014H01L2924/00014H01L23/32H05K1/0271H05K1/181H05K2201/09136H05K2201/10424
Inventor 龚纯诚范理潘卫进穆君伟张戈
Owner HUAWEI MACHINERY