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Micro-droplet-assisted nano-metal fine circuit processing method

A fine circuit and nano-metal technology, which is applied in the processing field of micro-droplet-assisted nano-metal fine circuit, can solve the problems of low efficiency and poor precision, achieve high efficiency, improve precision, and solve the effects of poor precision

Active Publication Date: 2021-11-02
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the problems raised by the background technology, the purpose of the present invention is to propose a micro-droplet-assisted nano-metal fine circuit processing method, which is simple to operate, effectively improves the accuracy of fine circuit board forming and repairing, and makes the forming and repairing High efficiency, improves the utilization rate of fine circuit boards, and solves the problems of poor accuracy and low efficiency of existing fine circuit forming and repair methods

Method used

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  • Micro-droplet-assisted nano-metal fine circuit processing method

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Comparison scheme
Effect test

Embodiment 1

[0060] A micro-droplet-assisted nanometer metal fine circuit processing method is applied to the fine circuit forming process of circuit boards, comprising the following steps:

[0061] A, using automatic optical detection technology to determine the position to be formed of the circuit board 1;

[0062] B, brush one layer of nanometer copper powder on the position to be formed of described circuit board 1;

[0063] C. Point a drop of transparent liquid drop 3 (specifically ethylene-tetrafluoroethylene liquid drop) at the position to be formed, and the surface of the circuit board 1 is not infiltrated with the transparent liquid drop 3;

[0064] D. Move the guide probe (using a metal probe with a diameter of 20 μm) that is infiltrated with the transparent liquid drop 3 to 100 μm from the position to be formed, and use the guide probe 4 and the transparent The liquid droplets 3 are in contact with each other, and guide the transparent liquid droplets 3 to move on the circuit b...

Embodiment 2

[0067] A micro-droplet-assisted nanometer metal fine circuit processing method is applied to the fine circuit forming process of circuit boards, comprising the following steps:

[0068] A, using automatic optical detection technology to determine the position to be formed of the circuit board 1;

[0069] B, brush a layer of nano copper powder on the position to be formed of the circuit board 1;

[0070] C. Point a drop of transparent liquid drop 3 (specifically ethylene-tetrafluoroethylene droplet with copper acetate added) at the position to be formed, the surface of the circuit board 1 is not infiltrated with the transparent liquid drop 3;

[0071] D. Use the conductive probe 5 connected to the negative pole of the DC power supply to negatively electrify the circuit board 1, and connect the guide probe 4 to the positive pole of the DC power supply so that the guide probe 4 is positively charged, so that the A potential difference of 3V is generated between the circuit board...

Embodiment 3

[0074] A micro-droplet-assisted nanometer metal fine circuit processing method, which is applied to the fine circuit forming processing of circuit boards, includes the following steps:

[0075] A, using automatic optical detection technology to determine the position to be formed of the circuit board 1;

[0076] B, brush a layer of nano copper powder on the position to be formed of the circuit board 1;

[0077] C. Point a drop of transparent liquid drop 3 (specifically ethylene-tetrafluoroethylene droplet with copper hydroxide added) at the position to be formed, the surface of the circuit board 1 is not infiltrated with the transparent liquid drop 3;

[0078]D. Use the conductive probe 5 connected to the negative pole of the DC power supply to negatively electrify the circuit board 1, and connect the guide probe 4 to the positive pole of the DC power supply to make the guide probe 4 positively electrified, so that the A potential difference of 3V is generated between the cir...

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Abstract

The invention discloses a micro-droplet-assisted nano-metal fine circuit processing method, which is applied to fine circuit forming processing or repairing processing of a circuit board. The method comprises the following steps of: A, determining a to-be-processed position of the circuit board; B, brushing a layer of nano-copper powder on the to-be-processed position of the circuit board; C, dripping a transparent liquid drop at the to-be-processed position, wherein the surface of the circuit board is not infiltrated with the transparent liquid drop; and D, enabling a guide probe infiltrated with the transparent liquid drop to be in contact with the transparent liquid drop, and guiding the transparent liquid drop to move on the circuit board according to a to-be-processed track. The micro-droplet-assisted processing method of the nano-metal fine circuit is simple to operate, the precision of forming and repairing of the fine circuit board is effectively improved, the efficiency of forming and repairing is high, the utilization rate of the fine circuit board is improved, and the problems that an existing fine circuit forming and repairing method is poor in precision and low in efficiency are solved.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a method for processing micro-droplet-assisted nanometer metal fine circuits. Background technique [0002] Fine circuit board is the support body of electronic components and the carrier of electrical connection. With the development of electronic products in the direction of miniaturization and digitization, the process method of printed circuit board is also moving towards high density, high precision, fine aperture, fine The development of wires, fine pitch, high reliability, multi-layer, high-speed transmission, light weight and thin shape has put forward higher requirements for the forming and repair of fine lines. In the existing process of forming and repairing circuit boards, copper particles are filled on the surface of the circuit board, and then sintered to sinter the particles into corresponding circuits, but the fineness of circuit forming and repairing ...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/02
CPCH05K3/00H05K3/027
Inventor 杨冠南吴润熹崔成强张昱
Owner GUANGDONG UNIV OF TECH