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A kind of processing method of micro droplet-assisted nano metal fine circuit

A fine circuit and nano-metal technology, which is applied in the processing field of micro-droplet-assisted nano-metal fine circuit, can solve the problems of low efficiency and poor precision, achieve high efficiency, improve precision, and solve the effects of poor precision

Active Publication Date: 2022-08-05
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the problems raised by the background technology, the purpose of the present invention is to propose a micro-droplet-assisted nano-metal fine circuit processing method, which is simple to operate, effectively improves the accuracy of fine circuit board forming and repairing, and makes the forming and repairing High efficiency, improves the utilization rate of fine circuit boards, and solves the problems of poor accuracy and low efficiency of existing fine circuit forming and repair methods

Method used

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  • A kind of processing method of micro droplet-assisted nano metal fine circuit

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] A micro droplet-assisted nano metal fine circuit processing method, which is applied to the fine circuit forming processing of circuit boards, comprises the following steps:

[0061] A. Use automatic optical detection technology to determine the position to be formed of the circuit board 1;

[0062] B. Apply a layer of nano-copper powder at the to-be-formed position of the circuit board 1;

[0063] C. A drop of transparent droplet 3 (specifically, an ethylene-tetrafluoroethylene droplet) is placed at the position to be formed, and the surface of the circuit board 1 is not infiltrated with the transparent droplet 3;

[0064] D. Move the guiding probe (using a metal probe with a diameter of 20 μm) infiltrated with the transparent droplet 3 to a distance of 100 μm from the position to be formed, and use the guiding probe 4 and the transparent The droplets 3 are in contact, and the transparent droplets 3 are guided to move on the circuit board 1 according to the trajectory...

Embodiment 2

[0067] A micro droplet-assisted nano metal fine circuit processing method, which is applied to the fine circuit forming processing of circuit boards, comprises the following steps:

[0068] A. Use automatic optical detection technology to determine the position to be formed of the circuit board 1;

[0069] B. Apply a layer of nano-copper powder at the to-be-formed position of the circuit board 1;

[0070] C, a drop of transparent droplet 3 (specifically adding copper acetate ethylene-tetrafluoroethylene droplet) at the position to be formed, the surface of the circuit board 1 is not infiltrated with the transparent droplet 3;

[0071] D. Use the conductive probe 5 connected to the negative electrode of the DC power supply to energize the circuit board 1 negatively, and connect the guide probe 4 to the positive electrode of the DC power supply to make the guide probe 4 positively energized, so that the A potential difference of 3V is generated between the circuit board 1 and t...

Embodiment 3

[0074] A micro droplet-assisted nano metal fine circuit processing method, which is applied to the fine circuit forming processing of circuit boards, comprises the following steps:

[0075] A. Use automatic optical detection technology to determine the position to be formed of the circuit board 1;

[0076] B. Apply a layer of nano-copper powder at the to-be-formed position of the circuit board 1;

[0077] C, a drop of transparent droplet 3 (specifically, an ethylene-tetrafluoroethylene droplet added with copper hydroxide) is placed at the position to be formed, and the surface of the circuit board 1 is not infiltrated with the transparent droplet 3;

[0078]D. Use the conductive probe 5 connected to the negative electrode of the DC power supply to energize the circuit board 1 negatively, and connect the guide probe 4 to the positive electrode of the DC power supply to make the guide probe 4 positively energized, so that the A potential difference of 3V is generated between th...

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Abstract

The invention discloses a micro-droplet-assisted nano-metal fine circuit processing method, which is applied to the fine circuit forming processing or repairing processing of circuit boards. The position to be processed of the circuit board is coated with a layer of nano copper powder; C. A drop of transparent droplets is placed on the position to be processed, and the surface of the circuit board is not infiltrated with the transparent droplet; D. Use with the transparent droplet The guide probe infiltrated by the droplet is in contact with the transparent droplet, and guides the transparent droplet to move on the circuit board according to the track to be processed. The micro-droplet-assisted nano-metal fine circuit processing method is simple to operate, effectively improves the precision of forming and repairing the fine circuit board, makes the forming and repairing efficiency high, improves the utilization rate of the fine circuit board, and solves the problem of The problems of poor precision and low efficiency of the existing fine line forming and repairing methods are solved.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a processing method of a micro droplet-assisted nano-metal fine circuit. Background technique [0002] The fine circuit board is the support of electronic components and the carrier of electrical connection. With the development of electronic products in the direction of miniaturization and digitization, the process method of printed circuit boards is also moving towards high density, high precision, fine aperture, fine The development of wires, fine pitch, high reliability, multi-layer, high-speed transmission, light weight and thin shape has put forward higher requirements for the formation and repair of fine lines. In the existing process of forming and repairing the circuit board, copper particles are filled on the surface of the circuit board, and then sintered, so that the through particles are sintered into corresponding circuits, but the fineness of circuit fo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/02
CPCH05K3/00H05K3/027
Inventor 杨冠南吴润熹崔成强张昱
Owner GUANGDONG UNIV OF TECH