A kind of cylindrical grinding process of wafer dicing blade

Abstract

The invention discloses an outer circle grinding process of a wafer cutting blade, which specifically comprises the following steps: installing a plurality of annular blades concentrically on a grinding tool, and separating a protective block between two adjacent annular blades; The tooling is rotated and installed on the machine tool. When installing, the machining center line of the machine tool coincides with the center line of the grinding tooling. The rotating grinding tooling is placed close to the rotating grinding wheel. The rotation direction of the grinding wheel is opposite to that of the grinding tooling. The edge is polished, and in the step S3, an industrial camera is used to find defects on the end face of the ring blade at any time, and the feed rate and the grinding position of the grinding wheel are controlled according to the defects of the ring blade. The present invention improves the accuracy of the grinding wheel to the grinding position of the ring blade. sex.

Description

Technical field: [0001] The invention relates to the technical field of production of a wafer cutting blade, in particular to an outer circle grinding process of a wafer cutting blade. Background technique: [0002] Wafer dicing is an essential process in the semiconductor chip manufacturing process. It is a post-process in wafer manufacturing. Its working principle is to divide the positive wafer of the chip into a single chip according to the size of the chip. Therefore, in this process, wafer cutting blades are generally used for cutting, and the sharpness of the wafer cutting blades is particularly important. [0003] At present, when processing wafers, wafer dicing blades are mainly used to process and cut wafers. The production process of wafer dicing blades generally needs to go through steps such as pretreatment, composite deposition, semi-finished product inspection, and outer circle grinding. When grinding, the edge of the ring blade is polished. This process is d...

AI Technical Summary

Problems solved by technology

[0003] At present, when processing wafers, wafer dicing blades are mainly used to process and cut wafers. The production process of wafer dicing blades generally needs to go through steps such as pretreatment, composite deposition, semi-finished product inspection, and outer circle grinding. When grinding, the edge of the ring blade is polished. This process is directly related to the final sharpness of the wafer cutting blade. During the grinding process, the grinding wheel is generally used to directly act on the edge of the ring blade to completely grind the edge of the ring blade. However, in the actual grinding process, the grinding of the grinding wheel can easily lead to stress damage inside the edge of the ring blade, which makes the edge of the ring blade very fragile, and often breaks when the wafer is subsequently cut phenomenon, the grinding position of the grinding wheel on the annular blade is particularly important, which is directly related to the pass rate and sharpness of the final shaped blade

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