Copper-clad laminate production device for printed circuit board, and board pressing method thereof

Abstract

The invention discloses a copper-clad laminate production device for a printed circuit board, and a board pressing method thereof. The copper-clad laminate production device comprises a feeding roller, a top bracket, a pressing hydraulic rod, a material taking and pressing mechanism, a substrate placing platform, a composite platform, a finished product placing platform, a screw rod, a screw rod driving motor, a sliding block and a raw material winding drum, a plurality of needle holes distributed in a matrix shape are formed in the middle of the composite platform, the lower surface, corresponding to the needle holes, of the composite platform is connected with a sealing cover, and the sealing cover covers the end openings, located at the lower end of the composite platform, of all the needle holes. The copper foil and the zinc foil are adsorbed through an adsorption mechanism composed of the air pump and the sealing cover, then a substrate, the copper foil and the zinc foil are pressed through the material taking and pressing mechanism, the overall structure is simple, and pressing is rapid; and after pressing, the copper foil and the zinc foil are in contact, so that the product can be stored for a long time.

Description

technical field [0001] The invention relates to a plate pressing device, in particular to a copper-clad laminate production device for printed circuit boards and a plate pressing method thereof. Background technique [0002] Copper-clad laminate is a plate-shaped material made by impregnating electronic glass fiber cloth or other reinforcing materials with resin, covering one or both sides with copper foil and hot pressing, referred to as copper-clad laminate. Various printed circuit boards of different forms and functions are selectively processed, etched, drilled and copper-plated on the copper clad laminate to make different printed circuits. It mainly plays the role of interconnection, insulation and support for printed circuit boards, and has a great influence on the transmission speed, energy loss and characteristic impedance of signals in the circuit. Therefore, the performance, quality and manufacturing of printed circuit boards The processability, manufacturing lev...

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Problems solved by technology

[0003] The current copper-clad laminate production process uses hot pressing, and the surface structure of the copper foil is easily damaged after being heated and pressed, so it is easily oxidized during processing and subsequent storage, so it is best not to store the finished product for a long time. It is of great significance to improve the processing method and prolong the storage time of products

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