Substrate treatment method
A treatment method and substrate technology, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problems of large waste liquid treatment burden, and achieve the effect of reducing the burden of waste liquid treatment and suppressing the burden
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Embodiment approach 1
[0084] Figure 5 From the part P1 in the resist film 902 ( Figure 6 ) schematically shows a flowchart of the substrate processing method in the first embodiment. Figure 6 ~ Figure 9 Each of these is a partial cross-sectional view schematically showing the first to fourth steps of the substrate processing method in the first embodiment.
[0085] refer to Figure 6 , first, a wafer 901 provided with a resist film 902 including a portion P1 is prepared. It should be noted that the resist film 902 may have a pattern shape (not shown) on the wafer 901 . In addition, the resist film 902 may be modified by using, for example, an etching mask or an implantation mask. Typically, the removal of the resist film becomes more difficult due to this modification.
[0086] refer to Figure 7 , in step T21( Figure 5 ), the ozone-containing aqueous solution 920 is brought into contact with at least a portion P1 of the resist film 902 . For this purpose, an aqueous solution 920 contai...
Embodiment approach 2
[0129] Figure 19 For the slave substrate processing device ( Figure 1 ~ Figure 3 ) schematically shows a flowchart of the substrate processing method in the second embodiment. This flow is the same as the flow in Embodiment 1 omitting step S20 ( Figure 10 ) corresponding to the process. Therefore, only the points of difference related to this omission will be described below, and the description of the same features as those in Embodiment 1 will be omitted.
[0130] Figure 20 ~ Figure 22 Each is a plan view schematically showing the first to third operations of the substrate processing apparatus in the second embodiment. It should be noted that, in Figure 20 ~ Figure 22 In, for the substrate processing device ( Figure 1 ~ Figure 3 ), only the positions of the spray nozzle 31 and the spray nozzle 41 are shown by dots, and the illustration of other configurations is omitted.
[0131] refer to Figure 20 , first, a wafer 901 ( Figure 6 ) installed in the substrate...
Embodiment approach 3
[0136] Figure 23 For the slave substrate processing device ( Figure 1 ~ Figure 3 ) schematically shows a flowchart of the substrate processing method in the third embodiment. In this embodiment, in step S20 ( Figure 10 : Before Embodiment 1), to the resist film 902 ( Figure 6 ) to irradiate ultraviolet light (UV). The wavelength of ultraviolet light is preferably 190 nm or less, for example, 172 nm. The irradiation of ultraviolet rays can be used with the substrate processing device ( Figure 1 ~ Figure 3 ) different devices to implement. In addition, since the structure other than the above is substantially the same as the structure of Embodiment 1 mentioned above, the same code|symbol is attached|subjected to the same or corresponding element, and description is not repeated. As a modified example, step S10( Figure 23 ) can also be in step S30 ( Figure 19 : Carried out before Embodiment 2).
[0137] According to this embodiment, it is possible to supply ammoni...
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Abstract
Description
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Application Information
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