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Conductive pulley device for metal wire and electroplating production line

A metal wire and guide wheel technology, applied in the direction of electrodes, electrolytic components, electrolytic process, etc., can solve the problems of difficult to guarantee product quality, difficult to carry out electroplating production efficiently, etc., and achieve the effect of eliminating tension fluctuations

Active Publication Date: 2022-07-29
SICHUAN WINNER SPECIAL ELECTRONICS MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, this conductive method and driving method can only be electroplated with metal wires of 60 μm or more in actual production, and it is difficult to efficiently carry out electroplating production and ensure product quality.

Method used

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  • Conductive pulley device for metal wire and electroplating production line
  • Conductive pulley device for metal wire and electroplating production line
  • Conductive pulley device for metal wire and electroplating production line

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Embodiment Construction

[0038] Hereinafter, the wire conductive guide wheel device and system and the drilling and grinding fluid supply method of the present invention will be described in detail with reference to the exemplary embodiments. It should be noted that "first", "second", etc. are only for the convenience of description and distinction, and should not be construed as indicating or implying relative importance. "Upper", "lower", "inner" and "outer" are only for convenience of description and constitute relative orientation or positional relationship, and do not indicate or imply that the referred component must have the specific orientation or position.

[0039] In the first exemplary embodiment of the present invention, the conductive guide wheel devices of the metal wire are arranged on both sides of the electroplating tank of the electroplating production line (that is, the electroplating production line includes at least two conductive guide wheel devices), and the conductive guide whee...

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Abstract

The invention provides a metal wire conductive guide wheel device and an electroplating production line. The metal wire conductive guide wheel device is arranged on both sides of an electroplating pool in the electroplating production line and includes a synchronous drive system, a synchronous guide wheel system, and a pressure roller miniature Damping system and closed-loop feedback system, in which the synchronous drive system can drive the metal pulley of the synchronous pulley system to rotate, the synchronous pulley system can drive the wire and make the wire conduct electricity, and the pressure roller micro damping system can test and eliminate the metal The tension fluctuation of the wire; the closed-loop feedback system can receive the tension fluctuation of the wire tested by the pinch roller micro damping system and judge whether the tension fluctuation of the wire exceeds the range that the pinch roller micro damping system can control, and adjust the speed of the drive motor to Eliminate wire tension fluctuations. The invention has the advantages of being able to detect the tension of the metal wire and feeding it back to the synchronous driving system of the guide wheel in real time, eliminating the tension fluctuation during the electroplating of the metal wire, and the like.

Description

technical field [0001] The invention relates to the technical field of materials for semiconductor, integrated circuit and LED packaging industries, and in particular, to a conductive guide wheel device and an electroplating production line of a metal wire with a self-driving function. Background technique [0002] In the field of semiconductor packaging, wire bonding is an important process, which is an important technology for connecting chips and external pins. The quality of the bonding effect directly affects the integration. As the volume of the current electronic components gradually decreases, this requires that the raw materials for the production of electronic components should be finer and smaller. The requirements for the production of bonding wires used to connect semiconductor devices and integrated circuits in electronic components are higher, and the diameter of the bonding wires should be thinner, which puts forward higher requirements for the production pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/00C25D17/12C25D7/06
CPCC25D17/00C25D17/12C25D7/0607
Inventor 郭理宾陈兴马珑珂
Owner SICHUAN WINNER SPECIAL ELECTRONICS MATERIALS
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