Technical method for preventing adhesion of cushion pad

A cushioning pad and anti-adhesion technology, which is applied to the unpacking of objects, the removal of binding materials, and packaging. It can solve the problems of inability to guarantee the complete separation of the extraction and separation points, the sticking of the copper clad laminate, and the impact on the yield, so as to reduce the adhesion. The probability of walking, the improvement of yield rate, and the effect of good applicability

Inactive Publication Date: 2021-11-23
林州致远电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to point out that when the current copper clad laminate is being processed, it cannot be guaranteed that the extraction separation point is completely separated. During the extraction process, due to the adhesion of the separation point, the copper clad laminate will be glued away when transplanting and extraction, and the copper clad laminate is prone to occur. Scratched and scrapped situations, problems that affect yield, provide a technical method to prevent cushion pads from sticking

Method used

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  • Technical method for preventing adhesion of cushion pad
  • Technical method for preventing adhesion of cushion pad
  • Technical method for preventing adhesion of cushion pad

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Experimental program
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Embodiment 1

[0044] see figure 1 , this embodiment provides a technical method for preventing the adhesion of the buffer pad, which is used to provide anti-adhesion protection when the copper clad laminate is processed. The method comprises the steps of:

[0045] S1 provides transplanting machines, machine tables, conveying devices, discharge tables, anti-adhesion devices and pressing parts.

[0046] The number of the anti-adhesion devices is four groups, and the four groups of the anti-adhesion devices are evenly distributed around the discharge table.

[0047] The pressing part is obtained by pressing the base plate, buffer pad and cover plate. Wherein, the cover plate is located above the base plate, and twenty sets of base plates and four sets of buffer pads are neatly stacked vertically. Two sets of buffer pads are located between the machine table and the base plate, and the remaining two sets of buffer pads are located between the base plate and the cover plate.

[0048] S2 plac...

Embodiment 2

[0065] see Figure 4 , this embodiment provides an anti-adhesion device, which is applied in the technical method for preventing the adhesion of the cushion pad as described in Embodiment 1. The anti-adhesion device includes an air blowing structure 1 , a positioning assembly 2 arranged on the air blowing structure 1 , a fixing assembly 3 and an air source (not shown in the figure).

[0066] The gas source is used to provide clean gas. The blowing structure 1 is used for blowing the extraction area. The air blowing structure 1 includes an air pipe 11 and an air nozzle 12 fixedly installed at one end of the air pipe 11 . One end of the air pipe 11 facing away from the air nozzle 12 is fixedly connected with the air source. The positioning assembly 2 includes a guide post 21 fixedly sleeved on the outer surface of the trachea 11 , and a bushing 22 compatible with the guide post 21 . The guide post 21 is screwed inside the bushing 22 . The fixing component 3 is used to insta...

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Abstract

The invention relates to a technical method for preventing adhesion of a cushion pad. The method comprises the following steps that S1, a transplanting machine, a machine table, a conveying device, a discharging table, an anti-adhesion device and a press-fit piece are provided; S2, the conveying device operates to directionally convey the press-fit piece to the discharging table along the machine table; S3, the transplanting machine treats the press-fit piece for separation; S4, while the step S3 is carried out, the anti-adhesion device is started to blow air to a pulling area and remove static electricity so as to assist separation; and S5, when a substrate is adhered, manual separation is carried out. The anti-adhesion device is used for increasing the separation force and removing static electricity to prevent adhesion of the separation area. According to the method, anti-adhesion protection measures are complete, the probability that the substrate is adhered away in the pulling process is reduced, the situation that a copper-clad plate is scratched and scrapped due to falling of the substrate is avoided, the loss of scratching and scrapping of the copper-clad plate is avoided, and the machining yield of the copper-clad plate is improved.

Description

technical field [0001] The invention relates to the field of copper clad laminate processing, in particular to a technical method for preventing buffer pads from sticking. Background technique [0002] When the copper clad laminate is being processed, 20 substrates need to be pressed at one time, and two buffer pads are placed on the upper and lower sides of the substrate for buffering. After pressing, it needs to be extracted and separated by a transplanter to realize the separation of the substrate and the buffer pad, so as to obtain Copper clad laminates. [0003] However, when the lower copper-clad laminate is being processed, it cannot be guaranteed that the extraction separation point is completely separated. During the extraction process, due to the adhesion of the separation point, the copper-clad laminate will be glued away during transplanting and extraction, and the copper-clad laminate will be easily scratched and damaged. The situation of scrapping affects the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65B69/00
CPCB65B69/0025
Inventor 徐升郁霞李广元
Owner 林州致远电子科技有限公司
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