Packaging structure and optical module

Abstract

The invention discloses a packaging structure and an optical module. The packaging structure comprises a packaging substrate, at least one semiconductor laser chip, at least one sub-substrate and a matching circuit, wherein the semiconductor laser chip and the sub-substrate are arranged on the packaging substrate, and at least part of the matching circuit is arranged on the sub-substrate; the semiconductor laser chip is provided with a signal electrode, the packaging substrate is provided with grounding metal and at least one signal line, and the at least one signal line is electrically connected with the signal electrode of the laser chip; the matching circuit comprises an input end, at least one electronic element and a grounding end; and the input end is electrically connected with the signal electrode of the laser chip, the two ends of at least one electronic element are electrically connected with the input end and the grounding end respectively, and the grounding end is electrically connected with the grounding metal of the packaging substrate. The sub-substrate is additionally arranged on the packaging substrate and used for designing laser matching circuits such as an RC circuit, so that coupling between a matching resistor and the GND and coupling between a filtering capacitor and the GND are reduced, the photoelectric bandwidth is improved, and good high-frequency performance is achieved.

Description

technical field [0001] The present application relates to the technical field of optical communication, in particular to a packaging structure and an optical module. Background technique [0002] The laser chip in the optical module mostly adopts the packaging design of COC (chip on ceramic, chip on ceramic substrate). The commonly used structure is as follows: figure 1 As shown, coplanar lines including ground metal 11' and signal lines 12' are designed on the package substrate 10', and the semiconductor laser chip 20' is mounted on the package substrate 10'. In order to reduce the volume of the optical module, the matching circuit of the laser, such as the filter capacitor 40' and the matching resistor 30', is generally integrated on the above-mentioned packaging substrate 10', and the semiconductor laser chip 20' is connected to the matching resistor 30' through a gold wire 50' , the matching resistor 30' is connected to the ground metal (GND) 11' through the filter capa...

AI Technical Summary

Problems solved by technology

The one-piece structural design in which the matching resistor 30' and the filter capacitor 40' are integrated into the packaging substrate 10' improves the degree of integration and reduces the volume of the optical module, but due to the link between the matching resistor 30' and the filter capacitor 40' and The ground metal GND 11' is on the same surface, and coupling between the link of the matching resistor 30' and the filter capacitor 40' and the ground metal GND 11' is easy to occur, which affects the quality of high-frequency signal transmission and reduces the photoelectric bandwidth

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