Method for cleaning residual soldering flux on surface of IGBT module

A surface residue and flux technology, which is applied in the field of IGBT module surface residue flux cleaning, can solve problems such as increased product scrap rate, and achieve the effects of facilitating cost control, ensuring production yield, and reducing the frequency of replacement

Pending Publication Date: 2021-11-26
安徽瑞迪微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Modules with flux attached to the surface flow into the next process, which will lead to an increase in the scrap rate of products in the next process

Method used

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  • Method for cleaning residual soldering flux on surface of IGBT module
  • Method for cleaning residual soldering flux on surface of IGBT module

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Embodiment Construction

[0016] The specific embodiment of the present invention will be described in further detail by describing the embodiments below with reference to the accompanying drawings, the purpose is to help those skilled in the art to have a more complete, accurate and in-depth understanding of the concept and technical solutions of the present invention, and contribute to its implementation.

[0017] Such as figure 1 and figure 2 As shown, the present invention provides a method for cleaning residual flux on the surface of an IGBT module, comprising the steps of:

[0018] S1. Provide cleaning liquid spraying device 6;

[0019] S2. After the IGBT module is removed from the cleaning solution of the washing machine, the cleaning solution spraying device 6 performs spraying and rinsing operations on the IGBT module.

[0020] Specifically, as figure 1 and figure 2 As shown, the cleaning machine has a cleaning tank 1 containing cleaning liquid, and the IGBT module is placed in the clea...

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Abstract

The invention discloses a method for cleaning residual soldering flux on the surface of an IGBT module. The method comprises the steps that S1, a cleaning fluid spraying device is provided; and S2, after the IGBT module is moved out of cleaning liquid of a cleaning machine, the cleaning liquid spraying device is used for spraying and washing the IGBT module. According to the method for cleaning the residual soldering flux on the surface of the IGBT module, the residual soldering flux on the surface of the IGBT module can be effectively removed by arranging the cleaning liquid spraying device, the frequency of cleaning liquid replacement is reduced, and cost control of product manufacturing is facilitated; and no obvious soldering flux residues exist on the surface of the washed module, and it can be guaranteed that the production yield is improved after the module is transferred to a next working procedure.

Description

technical field [0001] The invention belongs to the technical field of semiconductor product production technology, in particular, the invention relates to a method for cleaning residual flux on the surface of an IGBT module. Background technique [0002] In traditional IGBT module packaging, there will be a lot of flux residue after the chip and DBC board, DBC board and copper substrate are soldered by solder paste. Generally, a two-component solvent or n-bromopropane solvent is used as the cleaning solution, and the flux residue is removed by soaking in a cleaning machine. [0003] Due to the continuous cleaning of the modules in the cleaning tank of the cleaning equipment, the flux and other residues on the modules will remain in the cleaning solution, and the solvent cleaning ability will gradually decrease. Frequent replacement of the cleaning solution will inevitably increase the production cost of the product. Moreover, when the module is removed from the cleaning t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/08B08B3/02B23K101/40
CPCB23K3/08B08B3/02B23K2101/40
Inventor 杨幸运陶少勇陈小磊罗凯
Owner 安徽瑞迪微电子有限公司
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