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High-precision back drill manufacturing method

A production method and high-precision technology, which is applied in the manufacture of printed circuits, the formation of electrical connections of printed components, and electrical components, etc., can solve the problem that the slice test results cannot represent the actual situation, the stump length has a great influence, and the limitation of high-precision back drilling, etc. problem, achieve the effect of reducing extrusion, simplifying production process and reducing impact

Inactive Publication Date: 2021-11-26
深圳市华芯微测技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the slice test in the industry is mainly manual operation, and the slice making and reading levels of different personnel are different, and the slice test results may not represent the actual situation, especially under the conditions of multiple sets of high-precision back drilling requirements, different plate thicknesses The difference has a great influence on the length of residual piles, while manual slices can only be sliced ​​to test the depth of residual piles on the first slab to adjust the back drilling depth of all slabs, and the error is large
In summary, the back-drilling method commonly used in the industry currently has great limitations in the production of high-precision back-drilling

Method used

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  • High-precision back drill manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Example 1, see Figure 1-2 , a method for producing high-precision back drilling, comprising the steps of:

[0034] S1. Make a dummy target, press copper foil (2) on both sides of the core board (1), transfer the copper foil pattern, etch out the designed pattern, and press multiple sets of copper foil (2) on both sides The core board (1) is pressed and connected through PP (4) to form a PCB laminated board (5), and the target layer of the layered PCB laminated board (5) is etched in advance to design the target of the residual pile in the process side area For the target (3), a dummy target (6) corresponding to the target target (3) is etched out in advance in the process edge area of ​​the upper layer of the target layer during etching;

[0035] S2. Drill the test hole, drill the test hole (7) in the process side area of ​​the PCB press board (5), and set the offset repositioning pad at the test hole (7) of the outermost copper foil of the PCB press board (5) (8); ...

Embodiment 2

[0045] Embodiment 2, a kind of high-precision back drilling method comprises the following steps:

[0046] S1. Make a dummy target, press copper foil (2) on both sides of the core board (1), transfer the copper foil pattern, etch out the designed pattern, and press multiple sets of copper foil (2) on both sides The core board (1) is pressed and connected through PP (4) to form a PCB laminated board (5), and the target layer of the layered PCB laminated board (5) is etched in advance to design the target of the residual pile in the process side area For the target (3), a dummy target (6) corresponding to the target target (3) is etched out in advance in the process edge area of ​​the upper layer of the target layer during etching;

[0047] S2. Drill the test hole, drill the test hole (7) in the process side area of ​​the PCB press board (5), and set the offset repositioning pad at the test hole (7) of the outermost copper foil of the PCB press board (5) (8);

[0048] S3, imme...

Embodiment 3

[0057] Embodiment 3, a kind of high-precision back drilling method comprises the following steps:

[0058] S1. Make a dummy target, press copper foil (2) on both sides of the core board (1), transfer the copper foil pattern, etch out the designed pattern, and press multiple sets of copper foil (2) on both sides The core board (1) is pressed and connected through PP (4) to form a PCB laminated board (5), and the target layer of the layered PCB laminated board (5) is etched in advance to design the target of the residual pile in the process side area For the target (3), a dummy target (6) corresponding to the target target (3) is etched out in advance in the process edge area of ​​the upper layer of the target layer during etching;

[0059] S2. Drill the test hole, drill the test hole (7) in the process side area of ​​the PCB press board (5), and set the offset repositioning pad at the test hole (7) of the outermost copper foil of the PCB press board (5) (8);

[0060] S3, imme...

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Abstract

The invention relates to the technical field of PCB back drilling processing, and concretely relates to a high-precision back drill manufacturing method. The method comprises the steps of false target manufacturing, test hole drilling, copper deposition, plate plating, back drilling depth testing, back drilling in units, negative film electroplating and the like. By arranging a false target, a signal hole and a conductive hole, when back drilling is carried out on a test hole, a drilling machine, the false target, the signal hole and the conductive hole form a loop, the back drilling depth is calculated through on-off of the loop, then the back drilling depth in the unit during back drilling is determined, the operation method is simple, the test precision is high, and the length of the stub can be reduced to the maximum extent. An offset compound bonding pad is arranged, after the back drilling depth is tested, the offset of the back drilling hole during back drilling is judged through the concentricity of the back drilling hole and the offset compound bonding pad, then corresponding adjustment is made during back drilling in the unit, and the back drilling precision is further guaranteed.

Description

technical field [0001] The invention relates to the technical field of PCB back-drilling processing, in particular to a high-precision back-drilling manufacturing method. Background technique [0002] With the continuous improvement of the signal transmission rate of the circuit board, customers pay more and more attention to the loss value of the signal, among which the loss due to the reflection from the via stump is an important part of the source of the PCB end loss. In order to suppress the loss of signal vias, the industry adopts the back drilling process to reduce the length of the stump and suppress the loss. The production method of the conventional back-drilling process is to firstly set the back-drilling depth through theoretical calculation and drill a test hole, and then drill a test hole slice to actually measure the back-drilling depth and the length of the residual pile to adjust the set depth of the back-drilling and monitor whether the back-drilling is out ...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/42
CPCH05K3/42H05K3/423H05K3/0047H05K2203/0207
Inventor 史宏宇陈蓓李志东
Owner 深圳市华芯微测技术有限公司
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