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Heat-conducting silicone grease with gradually-increased heat conductivity coefficient and preparation method of heat-conducting silicone grease

A technology of thermal conductive silicone grease and thermal conductivity, which is applied in the direction of chemical instruments and methods, heat exchange materials, etc., can solve the problems of limited thermal conductivity, limited filling rate of thermal conductive powder, etc., and achieve good high temperature stability, excellent electrical properties, Easy construction and shaping effect

Pending Publication Date: 2021-11-30
GUANGZHOU HUINA NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing heat-conducting silicone grease products still generally have the problem of limited filling rate of heat-conducting powder, which leads to limited thermal conductivity and is difficult to meet the needs of market and industry development.

Method used

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  • Heat-conducting silicone grease with gradually-increased heat conductivity coefficient and preparation method of heat-conducting silicone grease
  • Heat-conducting silicone grease with gradually-increased heat conductivity coefficient and preparation method of heat-conducting silicone grease
  • Heat-conducting silicone grease with gradually-increased heat conductivity coefficient and preparation method of heat-conducting silicone grease

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] 1. A heat conduction coefficient of heat conductive dielectric is accumulated in the present embodiment, and the raw material group is:

[0022]

[0023] in:

[0024] The spherical alumina (1 to 5 μm particles) and aluminum nitride (3 to 6 μm having a particle diameter) were surface treated using hexamethililazine (the powder was treated under 80 ° C for 2 h, and then cooling) By 35 ~ 40 ° C, surface treatment is performed using hexamethilic siliconzine.

[0025] The thermal volatile oil is food grade white oil, its viscosity is 25 mPa · s, and the pH is determined by a pH of 7 ± 0.3.

[0026] 2, the present embodiment has the preparation method of the heat conductive silicone fat, the steps are as follows:

[0027] (1) First, the above silicone oil and a portion of the spherical alumina (70% by weight thereto) were stirred at a stirring speed of 30 Hz, and then the remaining spherical alumina was added to continue stirring at a stirring speed of 35 Hz, and mixed for 10 m...

Embodiment 2

[0031] 1. A heat conduction coefficient of heat conductive dielectric is accumulated in the present embodiment, and the raw material group is:

[0032]

[0033] in:

[0034] The spherical alumina (1 to 5 μm particles) and aluminum nitride (3 to 6 μm having a particle diameter) were surface treated using hexamethililazine (the powder was treated under 80 ° C for 2 h, and then cooling) By 35 ~ 40 ° C, surface treatment is performed using hexamethilic siliconzine.

[0035] The thermal volatile oil is food grade white oil, its viscosity is 25 mPa · s, and the pH is determined by a pH of 7 ± 0.3.

[0036] 2, the present embodiment has the preparation method of the heat conductive silicone fat, the steps are as follows:

[0037] (1) First, the above silicone oil and a portion of the spherical alumina (70 wt% thereof) were stirred at a stirring speed of 35 Hz, and then the remaining spherical alumina was added to continue stirring at a stirring speed of 30 Hz for 10 min, resulting in a...

Embodiment 3

[0041] 1. A heat conduction coefficient of heat conductive dielectric is accumulated in the present embodiment, and the raw material group is:

[0042]

[0043] in:

[0044] The spherical alumina (1 to 5 μm particles) and aluminum nitride (3 to 6 μm having a particle diameter) were surface treated using hexamethililazine (the powder was treated under 80 ° C for 2 h, and then cooling) By 35 ~ 40 ° C, surface treatment is performed using hexamethilic siliconzine.

[0045] The thermal volatile oil is food grade white oil, its viscosity is 25 mPa · s, and the pH is determined by a pH of 7 ± 0.3.

[0046] 2, the present embodiment has the preparation method of the heat conductive silicone fat, the steps are as follows:

[0047] (1) First, the above silicone oil and a portion of the spherical alumina (70 wt%) were stirred at a stirring speed of 30 Hz, then the remaining spherical alumina was added to continue stirring at a stirring velocity of 40 Hz for 15 min, resulting in a mixture;...

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Abstract

The invention discloses heat-conducting silicone grease with a gradually-increased heat conductivity coefficient. The heat-conducting silicone grease is prepared from the following raw materials in parts by weight: 80-100 parts of silicone oil, 1000-1200 parts of spherical aluminum oxide, 100-200 parts of aluminum nitride and 10-20 parts of a hot volatile oil agent. In addition, the invention further discloses a preparation method of the heat-conducting silicone grease with the gradually-increased heat conductivity coefficient. Through formula design, a certain proportion of hot volatile oil agent is used for replacing an oil agent with good thermal stability, after construction, the hot volatile oil agent is removed through self heating of a component but is not dried and solidified, and the product can still be kept stable in long-term use; and the effect of increasing the heat conductivity by increasing the filling amount of the heat-conducting powder is achieved in a disguised manner.

Description

Technical field [0001] The present invention relates to the field of high molecular sealing materials, and more particularly to a thermally conductive coefficient increasing thermally conductive silicone and a preparation method thereof. Background technique [0002] The thermally conductive silicone is a heat-conducting powder and a thermal stabilizing oil and other functional auxiliary, and is applied to a type of product between the heat generating surface and the heat dissipation surface, which determines the thermal conductivity of the thermal conductivity. The value of the thermal conductivity (W / mK) is in accordance with it. In addition to the factors of the thermal conductivity, in addition to the thermal conductivity coefficients of the filler itself, it is often related to the filling of the thermal powder, the greater the filling amount, the higher the thermal conductivity. [0003] At present, in order to improve the thermal conductivity of the heat conductive silic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08L91/06C08K9/06C08K7/18C08K3/28C09K5/14
CPCC08L83/04C09K5/14C08K2003/282C08L2201/08C08L91/06C08K9/06C08K7/18C08K3/28
Inventor 李大卿廖帮伟林鸿李嘉琪黄坚黄小平麦尉球张小琴
Owner GUANGZHOU HUINA NEW MATERIAL TECH
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