Double-channel temperature control device with supercooling enthalpy increasing function, control method and electronic equipment

Abstract

The invention provides a dual-channel temperature control device, a control method and electronic equipment. The dual-channel temperature control device comprises a low-temperature channel refrigerating system, a high-temperature channel refrigerating system and a supercooling heat exchanger; the high-temperature channel refrigerating system comprises a high-temperature channel compressor, a high-temperature channel evaporator, a high-temperature channel water tank, a high-temperature channel condenser, a high-temperature channel evaporator, a high-temperature channel main path expansion valve, a high-temperature channel main path pressure sensor and a high-temperature channel evaporator outlet temperature sensor; and the low-temperature channel refrigerating system comprises a low-temperature channel suction pressure sensor, a low-temperature channel suction temperature sensor and a low-temperature channel expansion valve. A path of evaporator is separated from the high-temperature channel refrigerating system, supercooling enthalpy increasing is carried out on liquid of the low-temperature channel refrigerating system, and the unit refrigerating capacity of the low-temperature channel refrigerating system is improved.

Description

technical field [0001] The application relates to the field of semiconductor manufacturing, in particular to a dual-channel temperature control device with supercooling and enthalpy increase, a control method and electronic equipment. Background technique [0002] In the semiconductor memory chip manufacturing process, during the etching process, the etching equipment uses a special temperature control device to control the temperature in the processing chamber in real time by continuously feeding a constant temperature circulating fluid into the internal flow channel of the processing device. [0003] With the development of the 3D NAND process, in the etching process of the memory chip, each etching process needs to be performed at different temperatures. The temperature switching time in the processing chamber affects the processing cycle of the chip, and fast temperature switching can effectively improve the chip processing efficiency. [0004] In order to reduce the te...

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Problems solved by technology

[0005] With the development of the current memory chip technology, the demand for the cooling capacity of the low-temperature channel of the temperature control device is gradually increasing. At present, the etching process of advanced memory chips requires The low temperature range required for the low temperature channel of the temperature control device is about -20 ~ -40 ° C, the temperature control range of the high temperature channel is 10 ~ 90 ° C, and the low temperature channel is under the working condition of -40 ~ -20 ° C. For the currently more commonly used R404a , R410a and other medium-temperature refrigerants have a low COP under low-temperature conditions, and increasing the cooling capacity requires a high input power of the compressor, resulting in generally large specifications of low-temperature channel compressors, and high cost and energy consumption of the refrigeration system

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