Multilayer plate with composite material and method for manufacturing the same

Abstract

A multilayer plate with composite material and a method thereof are described. The multilayer plate with composite material includes an aluminum-based thin sheet and a composite material layer. The aluminum-based thin sheet includes a first passivation layer, an aluminum-based metal layer, and a second passivation layer sequentially. The aluminum-based thin sheet includes a first surface and a second surface opposite to the first surface. The first and second surfaces are set with micro holes. A diameter of the micro holes in the second surface is ranging from 0.5 [mu]m to 10 [mu]m. The composite material layer includes a thermoplastic polymer and a fiber material. The composite material layer has a third surface and a fourth surface opposite each other. The second surface is adjacent to or connected to the third surface. At least one portion of the thermoplastic polymer fills into the micro holes in the second surface. According to the present invention, by adjust a lamination ratio of the aluminum-based thin sheets and the composite material layers, multilayer plates with composite material to achieve different weight reduction and metallic texture can be achieved.

Description

technical field [0001] The present invention relates to a hybrid material manufacturing technology, and in particular to a multi-layer board with composite material and its manufacturing method. Background technique [0002] In addition to the light and thin volume, consumers are increasingly concerned about the metal texture of the casing for 3C products. For example, the materials of notebook computer casings currently available in the market can generally be divided into three categories, namely plastic, metal, and fiber composite materials. The metal casing is sturdy, elegant in appearance, and delicate in touch. Therefore, the demand for high-end notebook computer products is mainly metal texture, especially the texture of aluminum alloy after anodized color development. [0003] At present, most of the casings of thin and light notebook computers use aluminum alloy anodized materials. With the pursuit of thinner and lighter notebook computers, the demand for material...

AI Technical Summary

Problems solved by technology

However, due to the small diameter of the holes, the gas in the holes cannot be discharged when using non-injection processes such as thermocompression bonding of plates, which results in poor bonding between the resin and metal parts, and is prone to delamination between different materials

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