Photosensitive resin composition for photocuring 3D printing as well as preparation method and application of photosensitive resin composition

A 3D printing, photosensitive resin technology, applied in the direction of additive processing, can solve the problems of anisotropy of resin mechanical properties, different molding directions, etc., to achieve the effect of improving service performance and eliminating anisotropy

Pending Publication Date: 2021-12-03
LINGNAN NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem of the anisotropy of the mechanical properties of the cured resin caused by the different molding directions of the existing photocurable 3D print

Method used

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  • Photosensitive resin composition for photocuring 3D printing as well as preparation method and application of photosensitive resin composition
  • Photosensitive resin composition for photocuring 3D printing as well as preparation method and application of photosensitive resin composition
  • Photosensitive resin composition for photocuring 3D printing as well as preparation method and application of photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Under dark conditions, in a 200mL container, add 40 grams of tricyclodecane dimethanol diacrylate, 20 grams of triethylene glycol dimethacrylate, 20 grams of tetrakis (3-mercaptopropionic acid) Pentaerythritol ester, 10 grams of glycidyl methacrylate, 2 grams of 1,5,7-triazabicyclo[4.4.0]dec-5-ene·tetraphenylborate (TBD·HBPh 4 ), 2 grams of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (TPO), 0.05 grams of phloroglucinol and 0.05 grams of 2-isopropylthioxanthone, stirred and mixed Finally, the photosensitive resin S1 was obtained and stored away from light.

Embodiment 2

[0048] Under dark conditions, in a 200mL container, add 50 grams of diurethane dimethacrylate, 30 grams of 1,6-hexanediol dimethacrylate, 10 grams of tetrakis (3-mercaptopropane acid) pentaerythritol ester, 2 grams of glycidyl methacrylate, 3 grams of 1,5,7-triazabicyclo[4.4.0]dec-5-ene·tetraphenylborate (TBD·HBPh 4 ), 5 grams of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (TPO), 2 grams of phloroglucinol and 0.05 grams of 2-isopropylthioxanthone, stirred and mixed Finally, the photosensitive resin S2 was obtained and stored away from light.

Embodiment 3

[0050] Under dark conditions, in a 200mL container, add 25 grams of tricyclodecane dimethanol diacrylate, 15 grams of triethylene glycol dimethacrylate, 40 grams of tetrakis (3-mercaptopropionic acid) Pentaerythritol ester, 20 grams of glycidyl methacrylate, 2 grams of 1,5,7-triazabicyclo[4.4.0]dec-5-ene·tetraphenylborate (TBD·HBPh 4 ), 1 g of isopropyl-9H-thioxanth-9-one, 2 g of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (TPO), 0.5 g of phloroglucinol and 0.05 g of 2-isopropylthioxanthone were stirred and mixed to obtain photosensitive resin S3, which was stored away from light.

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Abstract

The invention discloses a photosensitive resin composition for photocuring 3D printing as well as a preparation method and application of the photosensitive resin composition. The photosensitive resin composition comprises the following components in parts by weight: 40-80 parts of a poly alkene monomer, 10-40 parts of a poly thiol monomer, 2-20 parts of allyl glycidyl ether, 1-6 parts of a free radical photoinitiator, 1-5 parts of a photobase generator, 0-2 parts of a sensitizer and 0-2 parts of a stabilizer. During photocuring 3D printing forming, a thiol monomer and an alkene monomer are subjected to a free polymerization reaction, and meanwhile, the photobase generator is cracked to generate organic strong base. A printed product is further heated and activated, and residual sulfydryl in the resin further reacts with an epoxy group in alkene glycidyl ether, so that the mechanical property anisotropy formed by 3D curing layer-by-layer curing molding is reduced, and the service performance of the resin is improved.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a photosensitive resin composition for photocuring 3D printing and its preparation method and application. Background technique [0002] Due to the advantages of low energy consumption and high precision, light-curing 3D printing technology has been widely used in aerospace, biomedical, mold manufacturing and other fields. Currently commonly used photosensitive resins are mainly acrylate and epoxy resins. Among them, the acrylate photosensitive resin is mainly a free radical photosensitive resin, which has the advantages of fast photopolymerization rate and high activity, but the disadvantage is that the polymerization volume shrinks greatly, which seriously affects the printing accuracy; while the epoxy resin is a cationic photosensitive resin system. It has the advantages of small volume shrinkage and high strength, but the light polymerization rate is sl...

Claims

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Application Information

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IPC IPC(8): C08G75/045B33Y70/00
CPCC08G75/045B33Y70/00
Inventor 余彪伍家振惠永海李建鹏高天明
Owner LINGNAN NORMAL UNIV
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