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Resin composition and product thereof

A technology of resin composition and products, which is applied in the field of resin composition of products, can solve the problems of high heat resistance and low dielectric properties at the same time, and achieve high heat resistance, low dielectric properties and high dimensional stability sexual effect

Active Publication Date: 2021-12-03
ELITE ELECTRONICS MATERIAL KUNSHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, in order to meet high heat resistance, maleimide (maleimide) resin and benzoxazine resin are usually used to make laminates and printed circuit boards. However, the traditional benzoxazine resin is combined with horse The resin composition of imide resin cannot meet the growing requirements of high heat resistance, low dielectric property and high dimensional stability at the same time

Method used

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  • Resin composition and product thereof
  • Resin composition and product thereof
  • Resin composition and product thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0127] Preparation Example 1: Synthesis of benzoxazine resin A1 with structure shown in formula (2)

[0128] In a 500ml three-necked flask equipped with a condenser tube and a stirring rod, add 60ml of chloroform, add 0.1 mole (20.02 g) of 4,4'-diaminodiphenyl ether and 0.2 mole (61.68 g) of diallyl at room temperature Based on bisphenol A, after stirring for 30 minutes, add 0.8 mole (24 g) formaldehyde solution dropwise. After the dropwise addition, heat up to 80 to 100°C, keep stirring, keep warm and reflux for 3 to 6 hours, then cool to room temperature, add 0.2 moles (18.62 grams) of aniline, and 0.8 moles (24 grams) of formaldehyde solution was added dropwise again. After the dropwise addition was completed, the temperature was raised to 80 to 100 ° C, and the stirring was continued. Pour the solution into excess anhydrous ether, then wash with 3mol / L NaOH solution and deionized water, remove the anhydrous ether after the oil phase is separated, and obtain a brown viscous...

preparation example 2

[0130] Preparation example 2: Synthetic benzoxazine resin A2 of structure shown in formula (3)

[0131] Except that 0.1 moles (19.83 grams) of 4,4'-diaminodiphenylmethane was used to replace 0.1 moles (20.02 grams) of 4,4'-diaminodiphenyl ether, the remaining steps were the same as in Preparation Example 1, and the synthesized product was the formula (3 ) of the benzoxazine resin with the structure shown, n is an integer from 0 to 10.

preparation example 3

[0132] Preparation Example 3: Synthetic benzoxazine resin A3 of structure shown in formula (4)

[0133] Except using 0.2 moles (11.42 grams) of allylamine to replace 0.2 moles (18.62 grams) of aniline, all the other steps are the same as in Preparation Example 1, the synthetic product is the benzoxazine resin of the structure shown in formula (4), n is 0 to Integer of 10.

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Abstract

The invention relates to a resin composition which can be used for preparing products such as prepregs, resin films, laminated boards and printed circuit boards. The resin composition provided by the invention comprises benzoxazine resin and maleimide resin with the structures shown in the following formula (1). The product prepared from the resin composition has high heat resistance, low dielectricity and high dimensional stability, and can meet the processability requirements of multiple pressing and multiple assembling in the manufacturing process of a printed circuit board.

Description

technical field [0001] The invention belongs to the field of resin compositions, and in particular relates to a resin composition which can be used for preparing prepregs, resin films, laminates, printed circuit boards and other products. Background technique [0002] With the advent of the 5G era, printed circuit boards for mobile communications and automotive electronics have ushered in a new round of technological upgrades, which requires that the basic insulating materials in printed circuit boards not only have high heat resistance, low dielectric properties, but also It has high dimensional stability, etc., to meet the processability requirements of multiple pressing and multiple assembly during the production process of printed circuit boards. [0003] In the prior art, in order to meet high heat resistance, maleimide (maleimide) resin and benzoxazine resin are usually used to make laminates and printed circuit boards. However, the traditional benzoxazine resin is com...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08L61/34C08L63/00C08L83/04C08K7/18C08K7/14B32B15/08
CPCC08L79/085B32B15/08C08L2205/035C08L2205/03C08L2205/025B32B2307/306B32B2307/734B32B2457/08C08L61/34C08L63/00C08L83/04C08K7/18C08K7/14C08G73/06C08G14/06C08J5/24C08J2379/08C08J2479/04C08K3/36C08K5/3445C08L79/04C08L79/08C08J5/18C08J2483/04C08J2479/00C08J2463/00C08J5/246C08J5/244
Inventor 王荣涛贾宁宁尚振方于惟淼
Owner ELITE ELECTRONICS MATERIAL KUNSHAN