Power device, power module and packaging processes of power device and power module
A technology of power devices and power modules, which is applied in the field of power modules and their packaging technology, and power devices, can solve the problems of poor heat dissipation performance of thermal conductive silicone grease and discount of heat dissipation capacity of power modules, etc., achieve high integration, realize lightweight, reduce The effect of the heat transfer path
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[0052] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0053] Such as figure 1 with figure 2 As shown, the power device of this embodiment is specifically applied to a rail transit converter, and specifically includes a chip 105, a liner 104, and a water cooling plate 101. The liner 104 is located on both sides of the chip 105, and the water cooling plate 101 is directly welded to the Liner 104, thereby forming a double-sided water-cooled structure. The power device of the present invention integrates the substrate and heat sink in the existing power device 1, and directly replaces it with the water-cooled plate 101, which eliminates the heat dissipation silicon grease and thick copper base plate in the heat dissipation path of the chip 105, and reduces the heat transfer path, improving heat dissipation efficiency. Of course, in other embodiments, a single-sided water-cooled structure may also ...
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