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Prepreg composition, prepreg, circuit substrate and printed circuit board

A technology of circuit substrate and prepreg, which is applied in the direction of circuit substrate materials, printed circuits, printed circuit components, etc., can solve the problems of PCB defects and insignificant improvement of ion migration resistance, and achieve excellent dielectric constant and dielectric loss, Improving ion migration resistance and adjustable range of dielectric properties

Pending Publication Date: 2021-12-07
ZHEJIANG WAZAM NEW MATERIAL CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to improve the ion migration resistance of PCB, the traditional methods include optimizing the design of PCB structure, optimizing the use of ion migration resistant materials, adding ion trapping agents, and strict control of PCB processing procedures. Migration performance improvement is not significant and there is a risk of causing PCB defects

Method used

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  • Prepreg composition, prepreg, circuit substrate and printed circuit board
  • Prepreg composition, prepreg, circuit substrate and printed circuit board
  • Prepreg composition, prepreg, circuit substrate and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] The first resin of 72 parts by weight, the second resin of 28 parts by weight, the first dielectric filler of 40 parts by weight, the third dielectric filler of 20 parts by weight, the coupling agent of 1.8 parts, the curing agent of 3 parts and 10 parts of auxiliary cross-linking agent are mixed, adjusted to a suitable viscosity with xylene solvent, stirred and mixed evenly, so that the dielectric filler is evenly dispersed in the resin, and the glue is prepared.

[0063] Use 1080 glass fiber cloth to impregnate the above glue solution, and control the weight at 189±3g / m 2 , and then dried to remove the solvent to obtain a non-stick prepreg.

[0064] Stack six prepregs, cover both sides with TZA copper foil with a thickness of 1 oz, and perform temperature-programmed curing in a high-temperature vacuum press with a curing pressure of 60kg / cm 2 , the curing temperature is 170°C, the curing time is 2h, and then the temperature is raised to 270°C and cured for 1h to make...

Embodiment 2～ Embodiment 8

[0070] The manufacturing process is the same as in Example 1, and the proportioning ratio is changed as shown in Table 2.

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Abstract

The invention relates to a prepreg composition, a prepreg, a circuit substrate and a printed circuit board, the prepreg composition comprises resin and a dielectric filler, and the conductivity of the dielectric filler is less than or equal to 450 [mu] S / cm. In the prepreg composition disclosed by the invention, the number of free charged ions generated by the dielectric filler can be effectively controlled by controlling the conductivity of the dielectric filler. Therefore, when the printed circuit board prepared based on the prepreg composition is used, the quantity of free charged ions generated is small, so that the ion migration resistance of the printed circuit board is effectively improved.

Description

technical field [0001] The invention relates to the technical field of electronic industry, in particular to a prepreg composition, a prepreg, a circuit substrate and a printed circuit board. Background technique [0002] When working with electricity in a high temperature and high humidity environment, the ion migration (CAF) phenomenon of the printed circuit board (PCB) will cause its short circuit failure, which is more harmful. [0003] There are many factors that affect PCB ion migration, including internal factors such as PCB design structure and material selection, as well as external factors such as processing, storage and working environment. In order to improve the ion migration resistance of PCB, the traditional methods include optimizing the design of PCB structure, optimizing the use of ion migration resistant materials, adding ion trapping agents, and strict control of PCB processing procedures. The improvement in migration performance is not significant, and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L47/00C08L53/02C08K13/06C08K9/10C08K7/28C08K3/36C08K9/04C08K3/38C08J5/24C08K7/14C08L63/00H05K1/03
CPCC08L47/00C08J5/24C08K13/06C08K3/36C08K9/10C08K7/28C08K9/04H05K1/0373C08J2363/00C08K7/14C08J2347/00C08J2453/02C08L53/02C08K3/38C08K9/08C08L63/00
Inventor 魏俊麒韩梦娜董辉任英杰
Owner ZHEJIANG WAZAM NEW MATERIAL CO LTD
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