Device and method for testing frequency response of photoelectric detector chip
A technology of frequency response test and photodetector, which is applied in the direction of frequency measurement device, measurement device, electronic circuit test, etc., can solve the problem of large error, achieve the elimination of uneven response, realize frequency response test, and simplify the calibration process Effect
Active Publication Date: 2021-12-07
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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However, many of the above test methods are mainly aimed at packaged discrete devices, but for chip test scenarios, due to impedance mismatch, this test method has a large error
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[0030] In this embodiment, a mode-locked fiber laser is used as an optical frequency comb, and the pulsed light emitted by it has a repetition frequency of 21.939 MHz, the central wavelength of the light is about 1559 nm, and the 3-dB spectral width is 0.9 nm. Therefore, the scanning frequency step size of the test can be set to f r =21.939MHz, set the sweeping receiving frequency of the microwave network analysis module receiver to nf r =21.939MHz~25.01046GHz(n=1,2,3...,1140), the measured electrical signal amplitude spectrum V(nf of the optical frequency comb r ). Open the signal source output of the microwave network analysis module to satisfy f n =nf r / 2-0.5MHz (Δf = 0.5MHz) sweeping microwave signal, at this time the receiving frequency point of the receiver of the microwave network analysis module is correspondingly set at f n and nf r -f n, the electrical signal amplitude spectrum V(f n ) and V(nf r -f n ), the joint response S(nf r ), the calculation results...
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The invention discloses a device and a method for testing the frequency response of a photoelectric detector chip, belongs to the technical field of photoelectrons, and aims to provide a method for testing the frequency response of the photoelectric detector chip. A coherent optical comb spectrum signal generated by an optical frequency comb is input into an electro-optical modulator and modulated by a sweep frequency microwave signal output by a signal source of a microwave network analysis module, and the modulated optical signal is optically coupled into a photoelectric detector chip to be detected for photoelectric conversion, an electric signal obtained by photoelectric conversion is detected by a receiver of the microwave network analysis module, and a combined response only containing the frequency response of the photoelectric detector chip and the response of the microwave probe can be obtained by analyzing the detected electric signal. And then, microwave reference plane calibration, microwave power calibration and terminal reflection coefficient test are carried out to obtain various parameters required for calculating the response of the microwave probe, thereby calculating the response of the microwave probe. And finally, the response of the microwave probe is deducted from the combined response to obtain the frequency response of the photoelectric detector chip to be detected. The method has the photoelectric detector bare chip testing capability, and the photoelectric detector chip frequency response test can be realized without additional matching packaging.
Description
technical field [0001] The invention belongs to the optoelectronic device testing technology in the field of optoelectronic technology, and in particular relates to a device and method for testing the frequency response of a photodetector chip. Background technique [0002] With the advent of the big data era and the 5G era, the demand for high-speed and low-latency communication, high-speed real-time data exchange, and large-bandwidth real-time signal processing has surged, and the demand for developing high-speed, large-bandwidth integrated optoelectronic devices has become more and more urgent. . As the core photoelectric conversion device in optoelectronic devices, the photodetector's response characteristics play a major role in the overall performance of the integrated system that requires photoelectric conversion, and its testing is also of great significance. Before the photodetector chip is packaged and impedance matched, it generally has strong microwave reflectio...
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IPC IPC(8): G01R31/28G01R23/06G01M11/02
CPCG01R31/2881G01R23/06G01M11/02
Inventor 张尚剑何禹彤敬超王梦珂徐映刘永
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA