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A lead frame automatic material stacking equipment

A technology of automatic material collection and lead frame, which is applied in the direction of automatic packaging control, solid materials, packaging item types, etc., can solve the problems of poor collection effect, achieve the effect of maintaining stability, ensuring accuracy, and avoiding shaking damage

Active Publication Date: 2022-01-21
NINGBO DEZHOU PRECISION ELECTRONIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem of poor collection effect in the prior art, and propose a lead frame automatic material stacking equipment

Method used

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  • A lead frame automatic material stacking equipment
  • A lead frame automatic material stacking equipment
  • A lead frame automatic material stacking equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] refer to Figure 1-6 , a lead frame automatic material stacking equipment, including a material box conveyor belt 1, a frame conveyor belt 2 and a processing table 3, the material box conveyor belt 1 and the frame conveyor belt 2 are fixed and driven by external equipment, and the processing table 3 Both sides are fixed with loading boards 4, the bin conveyor belt 1 runs through the processing table 3, the frame conveyor belt 2 is located in the middle of the two loading boards 4 and is rotatably connected with the two loading boards 4 through a fixed rotating shaft, and the upper end of the processing table 3 runs through A discharge port 5 is opened, and a bearing plate 6 is fixed on the inner wall of the processing table 3. The upper end of the bearing plate 6 is embedded with a No. 1 pressure sensor 7. The bearing plate 6 supports the material box conveyor belt 1, and the bearing plate 6 and the material box convey The bottom of the belt on the upper side of the bel...

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Abstract

The invention discloses a lead frame automatic material stacking device, which comprises a material box conveyor belt, a frame conveyor belt and a processing table. Both sides of the processing table are fixed with carrying plates, and the material box conveyor belt runs through the processing table. , the frame conveyor belt is located in the middle of the two loading plates and the fixing shaft is rotatably connected to the two loading plates, the upper end of the processing table is provided with a discharge port, the inner wall of the processing table is fixed with a loading plate, the A No. 1 pressure sensor is embedded on the upper end of the bearing plate, and the bearing plate supports the material box conveyor belt. The advantage is that it can realize the distinction between the lead frame of copper material and iron material, and ensure the accuracy of collection, and the existence of the support plate can ensure that it will not be mixed after separation, and the collected one can be replaced by changing the angle of the two support plates. types, it is possible to separate and collect two materials, and both can pick out unnecessary lead frames.

Description

technical field [0001] The invention relates to the technical field of lead frame processing, in particular to a lead frame automatic stacking device. Background technique [0002] Lead frame is the basic material of semiconductor packaging and the carrier of integrated circuit chips. Most of the semiconductor integrated blocks need to use lead frame, which is an important basic material in the electronic information industry; [0003] At present, lead frames are mostly received manually during the receiving process of the production line, which consumes a lot of manpower and has low production efficiency, and counting and packaging are required after receiving the materials, which further reduces the production efficiency; [0004] And at present, when many lead frames are processed, the copper lead frame and the iron lead frame share the same machine. When using one lead frame to package the chip, it is easy to mix the lead frame of another material, and the existing equip...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65B35/24B65B1/32B65B7/26B65B57/14B65B63/00B65B31/04B03C1/22
CPCB65B35/24B65B1/32B65B7/26B65B57/14B65B63/00B65B31/04B03C1/22
Inventor 王李发周炬雄李勇付巍巍赵清
Owner NINGBO DEZHOU PRECISION ELECTRONIC CO LTD
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